| Allicdata Part #: | 345-1634-ND |
| Manufacturer Part#: |
HSF-55-30-Y-F |
| Price: | $ 24.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 12VDC 55X55X30.1MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-55-30-Y-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 22.14450 |
| 10 +: | $ 20.84040 |
| 25 +: | $ 19.53760 |
| 50 +: | $ 18.23510 |
| 100 +: | $ 17.58380 |
| 250 +: | $ 16.60690 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 2.165" (55.00mm) |
| Width: | 2.165" (55.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.185" (30.10mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.70°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
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Thermal Heat Sinks are devices typically used to cool electronic components. They are designed to wick heat away from the surface it is attached to, and then dissipate it into the atmosphere. The HSF-55-30-Y-F is a standard heat sink commonly used for LED applications.
The HSF-55-30-Y-F is a single slot compact heat sink with a maximum height of 55mm and a thermal resistance of 0.30°C/W. The heat sink body is constructed from a high quality aluminum alloy. It has an anodized finish that offers good corrosion resistance and materials compatibility. This type of heat sink is intended for use in applications where space is limited. It comes with pre-applied thermal pads which provide excellent heat transfer with minimal thermal resistance.
The HSF-55-30-Y-F is designed for mounting on any board with at least one mounting hole. Two mounting screws are included for easy installation and secure mounting. The mounting hole diameter is 6mm. It has an extruded fin design which helps increase the surface area for improved heat dissipation. The fins have a density of 105FPI (fins per inch) for optimal performance.
The HSF-55-30-Y-F is designed to work in both natural air convection and forced convection environments. When forced convection is in use, a fan is used to force air over the heat sink fins providing increased cooling performance. It is capable of dissipating up to 25W of heat when used with a fan. Without a fan, it can dissipate up to 10W.
In addition to LED applications, the HSF-55-30-Y-F can also be used for cooling other electronic components such as processors, power transistors, and power switching circuits. It can also be used in non-electronic applications such as household appliances and automotive applications.
The HSF-55-30-Y-F is a reliable and cost effective thermal solution for a variety of applications. It offers excellent thermal performance and is easy to install. With its pre-applied thermal pads, it requires minimal effort for efficient and effective cooling.
The specific data is subject to PDF, and the above content is for reference