| Allicdata Part #: | 345-1638-ND |
| Manufacturer Part#: |
HSF-55-35-Y-F |
| Price: | $ 25.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 12VDC 55X55X35.1MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-55-35-Y-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 22.58550 |
| 10 +: | $ 21.25750 |
| 25 +: | $ 19.92890 |
| 50 +: | $ 18.60040 |
| 100 +: | $ 17.93600 |
| 250 +: | $ 16.93960 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 2.165" (55.00mm) |
| Width: | 2.165" (55.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.382" (35.10mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.59°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management devices such as HSF-55-35-Y-F are commonly used in a variety of applications. The thermal device is specially designed for heat dissipation, temperature control, and vibration isolation. The heat sink is a mechanical device that works by dissipating heat away from its interface, allowing for better efficiency and improved reliability.
In its most basic form, the HSF-55-35-Y-F model functions by allowing air to pass over a metal fin structure which absorbs heat from the surrounding surface. A fan placed over the fins pulls the heat away and drives it out to the ambient air. This setup helps to maintain a steady temperature in multi-component systems, as well as contribute to improving the overall system efficiency.
The HSF-55-35-Y-F model is typically used in applications that require a high level of thermal-cycling between extremes. For instance, if a system runs continuously in a temperature-controlled environment, a steady-state design would work well. However, if the environment changes from hot to cold on a regular basis, a thermal-cycling design would be more suitable.
One of the most common applications for HSF-55-35-Y-F is in the field of servers and data storage. These devices help keep the temperature in the server room controlled, and make sure the server hard drives keep running without failure or slowdowns. By dissipating the heat away from the hard drives, the system can remain cooler, resulting in better reliability and stability. In addition, the system can be configured to automatically respond to temperature changes.
In addition to server applications, HSF-55-35-Y-F is also often used in the automotive industry. Heat sinks help reduce the temperature of the engine, providing improved durability and reliability. By managing the heat produced by the engine, the system can run more efficiently and provide improved performance.
Heat sinks are also used in other applications, such as heaters, air conditioning systems, and home appliances. These heat sinks can keep these systems running more smoothly, reducing the risk of breakdowns and helping maintain the overall performance.
Overall, the HSF-55-35-Y-F model is well-suited to a variety of applications, particularly those with a need for efficient thermal-cycling between extremes. The model can dissipate heat away from its interface, making it suitable for temperature control, vibration isolation, and other thermal management applications.
The specific data is subject to PDF, and the above content is for reference