| Allicdata Part #: | 345-1639-ND |
| Manufacturer Part#: |
HSF-55-40-B-F |
| Price: | $ 25.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | FANSINK 12VDC 55X55X40.1MM |
| More Detail: | Heat Sink BGA Aluminum Alloy Top Mount |
| DataSheet: |  HSF-55-40-B-F Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 22.81230 |
| 10 +: | $ 21.47100 |
| 25 +: | $ 20.12930 |
| 50 +: | $ 18.78740 |
| 100 +: | $ 18.11640 |
| 250 +: | $ 17.10990 |
| Series: | HSF |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Fins |
| Length: | 2.165" (55.00mm) |
| Width: | 2.165" (55.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.579" (40.10mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.55°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions are an integral part of any electronic device, as they help keep components from overheating. The HSF-55-40-B-F is one such solution, and is designed to function as a heat sink, providing a cooling system for components that generate heat. This article will explain its application field and working principle.
HSF-55-40-B-F Application Field
The HSF-55-40-B-F heat sink is designed for electronic components or assemblies that generate heat, such as CPUs, power supplies, and other electronics. It is ideal for use in small to medium sized applications such as desktop computers, embedded systems, or hobby projects. It can also be used in larger systems, such as servers and other large-scale applications.
One of the main advantages of using the HSF-55-40-B-F over other forms of thermal management is its easy installation, along with its reduced size and weight. This makes it considerably more attractive and economical than traditional liquid cooling solutions. Additionally, it is also compatible with a variety of standard mounting systems, allowing it to be used in almost any situation.
HSF-55-40-B-F Working Principle
The HSF-55-40-B-F works by dissipating heat away from the component into the surrounding environment. It uses a combination of a mechanical device and a thermal solution to achieve this. The mechanical device is a fan, which draws hot air away from the component and forces cooler air across the heat sink\'s fins. The thermal solution is then the dielectric material, or heat conductor, that runs throughout the center of the heat sink. This material helps to evenly disperse the heat across the entire length of the sink.
At the same time, the fan also helps to keep the heat sink cool, allowing it to perform at maximum efficiency. The advantage of a fan-based solution is that it can be easily scaled to meet the needs of virtually any cooling application, as it allows for different fan sizes, speeds, and rotor configurations.
The main advantage of the HSF-55-40-B-F is its combination of low cost, small size, and easy installation. It can be mounted quickly and easily in almost any location, and its slim profile makes it ideal for applications where space is at a premium. Additionally, its wide range of compatibility with standard mounting solutions makes it a highly attractive solution for even the most demanding applications.
Conclusion
The HSF-55-40-B-F heat sink is designed for a wide range of electronic components or assemblies that generate heat, and is suitable for use in both small and large applications. Its combination of low cost, small size, and easy installation makes it an attractive option for a variety of cooling applications. Additionally, its fan-based cooling system helps to ensure maximum efficiency while also allowing it to be easily scaled to meet the demands of any cooling application.
The specific data is subject to PDF, and the above content is for reference