HSF-55-45-B-F Allicdata Electronics
Allicdata Part #:

345-1641-ND

Manufacturer Part#:

HSF-55-45-B-F

Price: $ 25.61
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: FANSINK 12VDC 55X55X45.1MM
More Detail: Heat Sink BGA Aluminum Alloy Top Mount
DataSheet: HSF-55-45-B-F datasheetHSF-55-45-B-F Datasheet/PDF
Quantity: 50
1 +: $ 23.05170
10 +: $ 21.69530
25 +: $ 20.33940
50 +: $ 18.98340
100 +: $ 18.30540
250 +: $ 17.28850
Stock 50Can Ship Immediately
$ 25.61
Specifications
Material Finish: Black Anodized
Series: HSF
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip
Shape: Square, Fins
Length: 2.165" (55.00mm)
Width: 2.165" (55.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.776" (45.10mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 0.51°C/W
Material: Aluminum Alloy
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The HSF-55-45-B-F is a thermal heat sink that can effectively dissipate the heat from electronic devices which can be particularly tricky in tight spaces. It utilizes a combination of design elements to achieve maximum thermal insulation with a reasonable amount of fin area. The fins are arranged in a circle, which provides a higher level of heat exchange than linear spacing. The heat sink also has a built-in fan for improved cooling and air circulation.The primary function of a heat sink is to draw the heat away from the source and spread it out over a large area for a more efficient dissipation. To accomplish this, the HSF-55-45-B-F heat sink uses the fins to increase the surface area exposed to the air. This allows for a more rapid heat transfer over a larger area. This heat transfer is further improved by the presence of the fan as it helps direct air towards the fins which causes the air molecules to move faster, thereby increasing the rate of heat exchange.The device works by drawing the heat away from the heat source and transporting it to the fins by conduction. The fins then work by radiating the heat away via convection. This is done by forcing the air across the surface of the fins which takes the heat energy away as it passes over. The fan is used to create a higher flow of air and speed up this process.The HSF-55-45-B-F thermal heat sink is ideal for a number of applications including audio/visual equipment, automotive components, medical and telecommunications components, and other electronics that require efficient cooling. It is also suitable for small spaces as it features a compact design.The thermal heat sink also provides excellent thermal performance, making it an ideal choice for a range of products. Its relatively low profile makes it easy to fit in tight spaces and the fan assists in cooling even when there is a lack of airflow. It also reduces the power consumption of the electronic components due to the improved heat dissipation.In conclusion, the HSF-55-45-B-F thermal heat sink is great for applications that require a reliable heat sink with a compact design that can dissipate heat efficiently even in tight spaces. The combination of the fins and the fan helps create faster heat exchange, while its low profile allows it to fit in locations where space may be limited. It is also carefully crafted to provide excellent thermal performance, ensuring the device is able to run at a stable temperature for prolonged periods of time.

The specific data is subject to PDF, and the above content is for reference

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