HSF-55-45-Y-F

Series:	HSF
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Clip
Shape:	Square, Fins
Length:	2.165" (55.00mm)
Width:	2.165" (55.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.776" (45.10mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	0.51°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Introduction to HSF-55-45-Y-F Thermal-Heat Sinks

Thermal-heat sinks are essential components in a wide range of modern electronic devices, including computers, televisions, consumer electronics, and industrial equipment. They work to reduce the temperature of active electronic components by radiating heat away from them. The HSF-55-45-Y-F thermal-heat sink is an effective and reliable choice for many applications.

HSF-55-45-Y-F Features

The HSF-55-45-Y-F thermal-heat sink is a robust, solid-construction device with a black anodized finish. It has a slightly taller design than some other models, with a 55 mm length, 45 mm width, and 36 mm height. It is also lightweight at only 23 grams. The HSF-55-45-Y-F has an Intel-standard 9mm mounting hole pattern, and it is compatible with both LGA socket 1155 and LGA socket 1150/1151.

HSF-55-45-Y-F Applications

The HSF-55-45-Y-F is an ideal choice for cooling active components in motherboards, graphics cards, and high-end CPUs. It can also be used in a variety of other electronic devices, including servers, laptops, medical devices, and surveillance systems. It is an optimal choice for many applications due to its robust design, lightweight and slim size, and its compatibility with both LGA socket 1155 and LGA socket 1150/1151.

HSF-55-45-Y-F Working Principle

The HSF-55-45-Y-F functions by dissipating heat generated by its active components away from the components themselves. This is done via the conduction of thermal energy from the components to the heat sink itself, then to the surrounding environment. The heat sink includes a series of small fins which help to increase the surface area of the device, allowing more efficient heat transfer. Additionally, the vent design of the HSF-55-45-Y-F helps to increase air circulation, further improving cooling performance.

Conclusion

The HSF-55-45-Y-F thermal-heat sink is a versatile device which is suitable for a variety of electronic applications. It has a robust construction, a slim profile for maximum compatibility, and an Intel-standard 9mm mounting hole pattern. Additionally, its efficient heat dissipation capabilities make it an excellent choice for cooling active components, such as motherboards, graphics cards, and high-end CPUs.

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