HSS-B20-0508H-01R

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Bolt On and Board Mounts
Shape:	Rectangular, Fins
Length:	0.500" (12.70mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	1.180" (29.97mm)
Power Dissipation @ Temperature Rise:	4.7W @ 75°C
Thermal Resistance @ Forced Air Flow:	5.87°C/W @ 200 LFM
Thermal Resistance @ Natural:	15.83°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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HSS-B20-0508H-01R Thermal - Heat Sinks Application Field and Working Principle

Thermal - Heat Sinks are one of the most important components to keep electronics from getting too hot during their operation. The HSS-B20-0508H-01R is a thermal - heat sink designed to dissipate heat to maintain optimal electronic operating temperatures. In this article, we will take a closer look at the application field and working principle of the HSS-B20-0508H-01R thermal - heat sink.

Application Field

The HSS-B20-0508H-01R thermal - heat sink is designed for use with high-power integrated circuits such as microprocessors, power amplifiers, digital signal processors, and other high-speed chips. The heat sink can be used in a variety of applications, including medical equipment, industrial control systems, telecommunication systems, automotive electronics, and consumer electronics.The HSS-B20-0508H-01R thermal - heat sink is designed specifically for operation in harsh environments where temperatures and other conditions may vary quickly or between short and long-term periods. It can be used in hot and humid environments as well as those with extremely cold temperatures. Additionally, the heat sink has excellent corrosion and vibration resistance, making it suitable for outdoor applications.

Working Principle

The HSS-B20-0508H-01R thermal - heat sink works by dissipating heat generated by electronic components. It does this by absorbing the heat from the components and then radiating it away, using the heat sink\'s fins. The fins are fan-shaped in order to maximize their surface area, and they are also constructed of highly conductive materials such as aluminum to aid in the transfer of heat. The thermal - heat sink also features a highly efficient and wide-reaching thermal radiation groove system to further aid in heat transfer.In addition to its heat-dissipating capabilities, the HSS-B20-0508H-01R thermal - heat sink also offers a number of other benefits. It has excellent electrical insulation properties, helping to prevent short circuits and fires. The thermal - heat sink also features a self-cleaning effect, eliminating dust accumulation and improving overall performance.

Conclusion

The HSS-B20-0508H-01R thermal - heat sink is a highly efficient and reliable heat-dissipating device designed for use in a variety of environments and applications. Its fan-shaped fins and wide-reaching thermal radiation groove system help to effectively transfer heat away from electronic components and maintain optimal operating temperatures. Additionally, the thermal - heat sink offers excellent electrical insulation properties and self-cleaning effects, making it an ideal choice for applications requiring reliable and efficient heat dissipation.

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