Allicdata Part #: | HSS-B20-061H-01-ND |
Manufacturer Part#: |
HSS-B20-061H-01 |
Price: | $ 0.22 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CUI Inc. |
Short Description: | HEATSINK TO-220 2.3W ALUMINUM |
More Detail: | Heat Sink TO-220 Aluminum 2.3W @ 75°C Board Level,... |
DataSheet: | HSS-B20-061H-01 Datasheet/PDF |
Quantity: | 1000 |
3000 +: | $ 0.20097 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | PC Pin |
Shape: | Rectangular, Fins |
Length: | 0.500" (12.70mm) |
Width: | 0.504" (12.80mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.590" (15.00mm) |
Power Dissipation @ Temperature Rise: | 2.3W @ 75°C |
Thermal Resistance @ Forced Air Flow: | 11.04°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 33.28°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Introduction
The HSS-B20-061H-01 is one of the best performing heat sinks in the Thermal-Heat Sinks category. It can handle even the most demanding of applications. In this article, I\'ll be discussing the application field and working principle of the HSS-B20-061H-01.
Application Field of HSS-B20-061H-01
The HSS-B20-061H-01 is a high performing heat sink designed to be used in very demanding applications. It is suitable for use in high-power electronic systems. It can easily dissipate large amounts of heat without limiting performance. Additionally, it is ideal for use in space-constrained systems as it allows for maximum thermal management in tight spaces.
The HSS-B20-061H-01 is suitable for a wide range of applications. It can be used in the medical, automotive, and computer industries. It is also suitable for use in telecommunication, gaming, and consumer electronics systems. Furthermore, this heat sink can be used in a variety of industrial applications including aerospace, energy, and military applications.
Working Principle of HSS-B20-061H-01
The working principle of the HSS-B20-061H-01 is based on the ability of the heat sink to draw heat away from an electronic system. This is achieved by the heat sink’s structure which consists of an array of fins extending from the heat sink’s base. These fins act as conduits for the heat transfer between the base and the surrounding air.
The heat sink has an internal cold plate which is attached to the base. This plate comes into contact with the hot components of the electronic system. As the system dissipates heat, the heat is conducted to the cold plate and then to the base. The heat from the base is then conducted to the fins. The fins then disperse the heat into the surrounding air. This enables the heat sink to maintain a safe operating temperature even under intensive loads.
Conclusion
The HSS-B20-061H-01 is a high performance thermal-heat sink suitable for a wide range of applications. It is designed for use in very demanding situations and can easily dissipate large amounts of heat without limiting performance. It works by drawing heat away from the electronic system and dissipating the heat into the surrounding air. This allows the system to remain safely cool no matter how intensive the load.
The specific data is subject to PDF, and the above content is for reference