HSS-B20-061H-03

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	PC Pin
Shape:	Rectangular, Fins
Length:	0.500" (12.70mm)
Width:	0.510" (13.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.748" (19.00mm)
Power Dissipation @ Temperature Rise:	2.9W @ 75°C
Thermal Resistance @ Forced Air Flow:	5.72°C/W @ 200 LFM
Thermal Resistance @ Natural:	25.86°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks | HSS-B20-061H-03 Application Field and Working Principle

Heat sinks are a type of heat exchanger that absorbs heat from electronic components and dissipates the heat to the surrounding environment. They are used to reduce the temperature of components so that they are not damaged due to excessive heat. Heat sinks are typically made of materials such as aluminum, copper, and stainless steel, and they are designed to maximize the surface area available for heat transfer.The HSS-B20-061H-03 is a heat sink specifically designed for high-powered electronics applications. It is designed to provide maximum cooling efficiency by taking advantage of the increased thermal conductivity of its aluminum construction. The HSS-B20-061H-03 is constructed with a large aluminum fin array (over 40 fins in total) that promotes high heat dissipation. Additionally, the housing of the HSS-B20-061H-03 is divided into two compartments for better thermal isolation. The first compartment has been designed to contain a 60mm x 60mm x 10mm fan that can maximize air flow and provide better heat dissipation.The working principle of the HSS-B20-061H-03 heat sink is quite straightforward. When an electronic device, such as a processor or a voltage regulator, reaches its maximum operating temperature, the heat produced is transferred to the heat sink. The heat is conducted through the walls of the housing that contain the electronic components. The heat is then transferred to the large aluminum fins which absorb the heat and dissipate it to the surrounding environment. The presence of the fan allows for increased air flow across the fins, which increases the rate of heat dissipation.The HSS-B20-061H-03 is suitable for a wide variety of applications, including high-powered industrial and commercial electronics. It is well-suited for use in data centers, where it can provide critical temperature control to ensure the longevity of expensive electronics. Additionally, the HSS-B20-061H-03 is also highly suitable for applications such as medical imaging, radio frequency identification (RFID) systems, and even automotive electronics.The HSS-B20-061H-03 is constructed from quality aluminum and is designed to be long lasting and corrosion resistant. It includes a mounting frame and four mounting screws, providing secure installation. Additionally, it includes four rubber vibration dampers to minimize the risk of component vibrations sent through the system due to cooling fan movement. The HSS-B20-061H-03 has also been tested in extremely high temperature environments, and it is capable of carrying an operating temperature up to 140°C. Overall, the HSS-B20-061H-03 is a highly efficient heat sink solution designed for high-powered electronics applications. Its wide range of features makes it a great choice for applications where superior thermal performance and robustness are needed. With its high cooling capacity, long-lasting construction, and ease of installation, the HSS-B20-061H-03 is well-suited for a variety of applications, ranging from data centers to automotive electronics.

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