| Allicdata Part #: | 102-4176-ND |
| Manufacturer Part#: |
HSS-B20-0635H |
| Price: | $ 0.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEATSINK TO-220 2.6W ALUMINUM |
| More Detail: | Heat Sink TO-220 Aluminum 2.6W @ 75°C Board Level,... |
| DataSheet: |  HSS-B20-0635H Datasheet/PDF |
| Quantity: | 901 |
| 1 +: | $ 0.25200 |
| 10 +: | $ 0.23940 |
| 25 +: | $ 0.22756 |
| 50 +: | $ 0.22151 |
| 100 +: | $ 0.21848 |
| 250 +: | $ 0.20349 |
| 500 +: | $ 0.19152 |
| 1000 +: | $ 0.17357 |
| 5000 +: | $ 0.16758 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.520" (13.21mm) |
| Width: | 0.250" (6.35mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.748" (19.00mm) |
| Power Dissipation @ Temperature Rise: | 2.6W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 28.85°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks
The HSS-B20-0635H is a thermal-heat sink, a device for dissipating heat from heat-generating components. The heat sink uses a large area of metals with good thermal conductivity to absorb and spread the heat over a large area. This creates a larger surface area and lower temperature on each of the components, allowing it to operate more efficiently and safely. The thermal-heat sink transports heat from the source towards a medium such as air, a liquid, or a thermal-conductor material such as a semiconductor.
Application Field
The HSS-B20-0635H is specifically designed for high power and high temperature applications. It is widely used in power supplies, power amplifiers, computers, and semiconductor processing equipment. Its application also includes power semiconductors, optoelectronics, automotive electronics, LED lighting, and several other applications.
Working Principle
The working principle of the HSS-B20-0635H is based on the physics of thermodynamics. It is designed to efficiently transfer the heat generated from a component to its environment. This is a two-step process, beginning with the transfer of heat from the component to the heat sink. Secondly, the heat is dissipated from the heat sink by conduction, convection, or radiation.
When the heat sink absorbs the heat, it translates it through the metal fin. Heat is dissipated from the fins by the surrounding air. This is done via convection. The heat is transferred from the hotter area of the fins to the cooler area of the air. The heat sink also uses the cooling effect of the fan. The fan accelerates the air flow around the heat sink, allowing for a greater rate of heat dissipation.
In addition to the fan, the thermal-heat sink can be used with a liquid coolant. Heat is allowed to transfer from the heat sink to the liquid and then transferred to a radiator. Here, the heat is dissipated to the surrounding air using a fan.
The HSS-B20-0635H thermal-heat sink is an efficient device for heat dissipation. It is used to protect components from overheating and ensure they last longer and function properly. With its multiple thermal-management options, the HSS-B20-0635H can ensure safe and efficient operations in most high temperature applications.
The specific data is subject to PDF, and the above content is for reference