HSS-B20-065V

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	PC Pin
Shape:	Rectangular, Fins
Length:	0.500" (12.70mm)
Width:	0.504" (12.80mm)
Diameter:	--
Height Off Base (Height of Fin):	1.500" (38.10mm)
Power Dissipation @ Temperature Rise:	4.0W @ 75°C
Thermal Resistance @ Forced Air Flow:	5.01°C/W @ 200 LFM
Thermal Resistance @ Natural:	18.63°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks: HSS-B20-065V Application Field and Working Principle

The HSS-B20-065V heat sink is designed for applications where the maximum operating temperature can reach up to 189°F (87°C). This versatile device is suitable for a wide variety of applications ranging from automotive to consumer electronics, communications, aerospace, industrial, and defense. Heat sinks have long been used in the electronics industry as a way of managing thermal loads and dissipating heat away from sensitive components. The HSS-B20-065V utilizes an advanced, highly reliable, high quality aluminum heat sink design to facilitate the efficient and effective transfer of heat away from the component or module of interest. The primary goal of the HSS-B20-065V is to provide a successful cooling solution with minimal microbial growth and a long-term stable system maintainability. To achieve this, the HSS-B20-065V features an expanded structure of extruded aluminum bar, which increases the surface area and effectively dissipates heat throughout the heat sink. The aluminum bars feature a specially designed topology that increases the contact area, thus helping to increase the thermal dissipation efficiency. Furthermore, the heat sink utilizes a unique thermal plate design, which helps promote uniform thermal distribution throughout the heat sink, allowing for effective heat dissipation away from the component or module of interest. The HSS-B20-065V also features a unique dual heat pipe assembly which offers enhanced performance and increased durability over a single-pipe assembly. The dual heat pipe design offers greater flexibility in the placement of the heat sink, allowing it to be placed in high-heat areas where a single-pipe assembly may not provide the same level of performance. This ensures that the thermal dissipation process remains optimal and efficient while also providing reliability and durability. In terms of its working principle, the HSS-B20-065V heat sink is designed to efficiently transfer heat away from the component or module of interest by leveraging a combination of its heat dissipating aluminum structure, thermal plate design, and dual heat pipe assemblies. The aluminum structures facilitate the efficient transfer of heat away from the component or module, while the thermal plate design ensures uniform thermal distribution throughout the heat sink. This helps to minimize hot spots and other thermal issues which can reduce heat sink performance. The dual heat pipe assembly further facilitates the efficient transfer of heat away from the component or module, while increasing the overall reliability and durability of the heat sink. Overall, the HSS-B20-065V heat sink is designed to provide a successful cooling solution for a wide variety of applications ranging from automotive to consumer electronics, communications, aerospace, industrial, and defense where the maximum operating temperature can reach up to 189°F (87°C). Its combination of efficient heat dissipating aluminum structure, thermal plate design, and dual heat pipe assemblies make it an ideal cooling solution for applications of this nature.

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