Allicdata Part #: | HSS-B20-074H-ND |
Manufacturer Part#: |
HSS-B20-074H |
Price: | $ 0.30 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CUI Inc. |
Short Description: | HEATSINK TO-220 3.6W ALUMINUM |
More Detail: | Heat Sink TO-220 Aluminum 3.6W @ 75°C Board Level,... |
DataSheet: | HSS-B20-074H Datasheet/PDF |
Quantity: | 1000 |
10000 +: | $ 0.27027 |
Specifications
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | PC Pin |
Shape: | Rectangular, Fins |
Length: | 0.394" (10.00mm) |
Width: | 0.830" (21.08mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.748" (19.00mm) |
Power Dissipation @ Temperature Rise: | 3.6W @ 75°C |
Thermal Resistance @ Forced Air Flow: | 5.39°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 20.59°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Description
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Thermal – Heat Sinks
Heat sinks are devices used to absorb and dissipate heat from other components or devices that require cooling. This is done by either introducing an air flow that is colder than the device needing cooling or dissipating heat through a material that has high thermal conductivity, usually metal. Heat sinks are a very important component in the cooling system of many electronic devices, including computers and smartphones. A heat sink can be used to dissipate the heat from a single component or multiple components. Heat sinks can be made of different materials, including copper, aluminum, and steel, and can come in a variety of shapes and sizes.The HSS-B20-074H is a thermal-heat sink that is designed to provide a high level of thermal conductivity and cooling. It is constructed from a combination of aluminum and copper alloy materials to provide an optimal thermal performance. The HSS-B20-074H is designed for use in high-performance industrial applications, including semiconductor and LED applications. The heat sink is designed to provide efficient cooling for both low and high power applications.The HSS-B20-074H has a fin structure which maximizes the surface area exposed to the air, which helps increase the heat dissipation rate. The heat sink has a thin profile, allowing it to be mounted in tight spaces. The heat sink includes an extended mounting flange with an anodized surface finish to resist corrosion and provide superior thermal transfer from the heat sink to the component or device that needs cooling.The HSS-B20-074H is designed to operate in a variety of environmental conditions. It is an air-type heat sink and requires airflow to work properly. The heat sink can be used in applications with temperatures ranging from -40°F (-40°C) to 350°F (177°C). It has a patented cooling method which helps keep the device or component cool while minimizing noise and energy consumption during operation.The HSS-B20-074H is a reliable and durable thermal-heat sink that is designed for maximum efficiency and performance. It has a robust construction that ensures it can stand up to the rigors of the environment in which it is used. The HSS-B20-074H provides an efficient way to cool electronic components and devices and can be used in a variety of industrial and consumer applications.The specific data is subject to PDF, and the above content is for reference
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