| Allicdata Part #: | HSS-B20-085H-ND |
| Manufacturer Part#: |
HSS-B20-085H |
| Price: | $ 0.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEATSINK TO-220 3.4W ALUMINUM |
| More Detail: | Heat Sink TO-220 Aluminum 3.4W @ 75°C Board Level,... |
| DataSheet: |  HSS-B20-085H Datasheet/PDF |
| Quantity: | 1000 |
| 5000 +: | $ 0.22932 |
| Shape: | Rectangular, Fins |
| Length: | 0.303" (7.70mm) |
| Width: | 0.775" (19.68mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | 3.4W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 7.46°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 22.06°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The HSS-B20-085H is a class of thermal management device known as a “heat sink”. Heat sinks are used to control the temperatures of electric components and to improve performance by dissipating heat away from the component. The HSS-B20-085H heat sink consists of a completely sealed aluminum body equipped with a microchannel cooler to improve thermal transfer efficiency. It also features a curved surface to reduce air turbulence.
The HSS-B20-085H is designed for use with high power sub-ohm electronic components such as voltage regulators, amplifiers, and micro-controllers. The heat sink’s aluminum construction is engineered to ensure excellent heat dissipation and its microchannel design helps to maximize heat transfer. The heat sink can also be used in conjunction with a fan to further enhance cooling efficiency.
The working principle of the HSS-B20-085H is based on conduction cooling. Heat is conducted away from the electronic component through the heat sink and transferred to the surrounding air by convection, absorption, and evaporation. The heat sink’s curved surface helps to reduce air turbulence around the component and improves the transfer of heat. The microchannel cooler further helps to increase the efficiency of heat transfer.
The HSS-B20-085H is highly reliable and has a long service life. Its aluminum construction is corrosion resistant and the heat sink’s design is compact, lightweight, and capable of dissipating heat over a large area. This makes it ideal for use in tight spaces or in applications where cooling is critical.
The HSS-B20-085H is a reliable and highly efficient thermal management device suitable for a wide range of applications. Its microchannel cooler, curved surface, and aluminum construction make it ideal for use with high power sub-ohm electronic components such as voltage regulators, amplifiers, and micro-controllers. Its efficient working principle ensures reliable operation and a long service life, making the HSS-B20-085H an excellent choice for a variety of thermal management needs.
The specific data is subject to PDF, and the above content is for reference