| Allicdata Part #: | 102-4171-ND |
| Manufacturer Part#: |
HSS-B20-095H |
| Price: | $ 0.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEATSINK TO-220 4.1W ALUMINUM |
| More Detail: | Heat Sink TO-220 Aluminum 4.1W @ 75°C Board Level,... |
| DataSheet: |  HSS-B20-095H Datasheet/PDF |
| Quantity: | 487 |
| 1 +: | $ 0.38430 |
| 10 +: | $ 0.36540 |
| 25 +: | $ 0.34726 |
| 50 +: | $ 0.33806 |
| 100 +: | $ 0.33346 |
| 250 +: | $ 0.31059 |
| 500 +: | $ 0.29232 |
| 1000 +: | $ 0.26492 |
| 5000 +: | $ 0.25578 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.441" (11.20mm) |
| Width: | 0.866" (22.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.626" (15.90mm) |
| Power Dissipation @ Temperature Rise: | 4.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 18.34°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Heat sink systems are a critical part of any thermal system design. Without proper heat sinking, any device can quickly become hot due to inefficient system design or insufficient cooling. The HSS-B20-095H thermal heat sink is a versatile thermal system component designed for use in a variety of applications.
The HSS-B20-095H thermal heat sink is designed to be compatible with common shapes and sizes of heat-sinkable components. This makes it easy to integrate the thermal heat sink into other systems such as computer cases, server racks, and so on. The HSS-B20-095H also includes adjustable fins, which provide flexibility in optimizing the thermal characteristics of the system.
The working principle behind the HSS-B20-095H thermal heat sink is thermal convection. Thermal convection is the process by which heat is moved away from the device and dispersed away from heat-sensitive components. The fins on the HSS-B20-095H work to increase the rate of convection by allowing the air to flow over the fins and take away the heat. This process is then repeated over and over until the desired thermal characteristics are achieved.
The HSS-B20-095H thermal heat sink is designed to be used in a variety of application fields, including medical and industrial applications. In medical applications, the HSS-B20-095H can be used to dissipate heat from high powered medical imaging equipment. It is also suitable for use in industrial applications, such as heat dissipation for high powered devices, and computers, as well as for providing thermal management for electronic parts.
The HSS-B20-095H is designed to be a turn-key solution for thermal management and heat dissipation. It is relatively easy to install and maintain, and provides excellent thermal performance. With adjustable fins, the HSS-B20-095H is able to be optimized for any system, allowing for optimal cooling performance. This makes the HSS-B20-095H an excellent choice for thermal applications.
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