| Allicdata Part #: | HSS-B20-097H-ND |
| Manufacturer Part#: |
HSS-B20-097H |
| Price: | $ 0.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEATSINK TO-220 3.6W ALUMINUM |
| More Detail: | Heat Sink TO-220 Aluminum 3.6W @ 75°C Board Level,... |
| DataSheet: |  HSS-B20-097H Datasheet/PDF |
| Quantity: | 1000 |
| 10000 +: | $ 0.29484 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.394" (10.00mm) |
| Width: | 0.830" (21.08mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.748" (19.00mm) |
| Power Dissipation @ Temperature Rise: | 3.6W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 5.39°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 20.59°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks are essential components of any electronics-related product. HSS-B20-097H is a compact heat sink designed to maximize thermal performance without sacrificing space. This heat sink helps ensure a steady and efficient thermal environment for the electronic components it is installed with.
HSS-B20-097H is primarily used in mobile communication and medical device applications. In these industries, thermal design and heat management are critical for the optimal functioning of the equipment. HSS-B20-097H is capable of dissipating heat from the components to keep them from failing under excessive temperatures. With a superior thermal design, this heat sink is suitable for applications that demand reliable and efficient thermal cooling.
The working principle of HSS-B20-097H is based on the principle of convection. When the heat sink is placed in contact with a hot component, heat is transferred from the component to the heat sink. The transferred heat is then rapidly transferred away from the heat sink, through channels and fins in the heat sink body that guide the air through. The heat is then released out into the environment, allowing the component to maintain a cool operating temperature. The heat sink is also designed to be highly efficient in its heat transfer, ensuring that only a minimal amount of heat is lost from the component.
HSS-B20-097H is also designed to be highly efficient in its heat transfer ability. The large surface area of the fins increases the amount of heat that is transferred away from the component to the environment. The construction is also designed to be lightweight, yet durable to ensure reliable use. Additionally, the design is engineered to enable easy installation, providing for a simple and effective install process.
In conclusion, HSS-B20-097H is a unique heat sink design that is designed to maximize thermal performance without sacrificing space. Its excellent thermal design makes it suitable for applications in the medical and mobile communication industries that require reliable and efficient cooling solutions. The heat sink’s convection-based design ensures a steady and efficient transfer of heat from the component to the heat sink, while its superior construction makes it lightweight and durable. Ultimately, HSS-B20-097H is an efficient and reliable thermal solution for applications in these industries.
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