| Allicdata Part #: | HSS-B20-NP-01-ND |
| Manufacturer Part#: |
HSS-B20-NP-01 |
| Price: | $ 0.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEATSINK TO-220 4.1W ALUMINUM |
| More Detail: | Heat Sink TO-220 Aluminum 4.1W @ 75°C Board Level |
| DataSheet: |  HSS-B20-NP-01 Datasheet/PDF |
| Quantity: | 1000 |
| 8000 +: | $ 0.13230 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-220 |
| Attachment Method: | -- |
| Shape: | Rectangular, Fins |
| Length: | 0.787" (20.00mm) |
| Width: | 0.775" (19.68mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.303" (7.70mm) |
| Power Dissipation @ Temperature Rise: | 4.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 7.05°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 18.29°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is an essential component of any system and the introduction of new technologies have allowed thermal solutions to evolve at a faster rate. This has encouraged the development of the HSS-B20-NP-01 thermal heat sink which provides high temperature cooling for a variety of applications.
The HSS-B20-NP-01 thermal heat sink is designed for efficient cooling of electronic components. It has a slim profile that fits into tight spaces, allowing it to be used in a variety of applications. It\'s also easy to install and provides exceptional performance.
The HSS-B20-NP-01 thermal heat sink is based on the patented cross fin technology that integrates a micro fin array cooling structure with a novel distribution system. This allows it to deliver greater cooling performance compared to traditional heat sinks. It features a unique fin shape that increases the heat exchange rate and enhances the heat dissipation.
The HSS-B20-NP-01 thermal heat sink is specifically designed to address the needs of extreme temperature applications. It has the ability to maintain optimal temperatures even in complex operating conditions. This is due to its effective cooling area, rapid heat transfer, and low thermal resistance.
The HSS-B20-NP-01 thermal heat sinks is not just designed for cooling electronic components, but also for high temperature applications. With its patented design, it can maintain optimal temperatures in high temperature applications such as in-plant manufacturing processes and laser projects.
The HSS-B20-NP-01 heat sink also features a high pressure, low noise fan for improved heat dissipation. The fan runs at lower noise levels, allowing for safer operation in rigorous applications.
The HSS-B20-NP-01 thermal heat sink is an efficient and reliable thermal solution that can be used in a wide variety of applications. It is ideal for cooling electronic components, as well as for high temperature applications such as in-plant manufacturing processes and laser projects. With its innovative design and high performance, the HSS-B20-NP-01 provides an effective thermal solution for any environment.
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