| Allicdata Part #: | HSS-B20-NP-02-ND |
| Manufacturer Part#: |
HSS-B20-NP-02 |
| Price: | $ 0.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEATSINK TO-220 3.6W ALUMINUM |
| More Detail: | Heat Sink TO-220 Aluminum 3.6W @ 75°C Board Level |
| DataSheet: |  HSS-B20-NP-02 Datasheet/PDF |
| Quantity: | 1000 |
| 10000 +: | $ 0.18018 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-220 |
| Attachment Method: | -- |
| Shape: | Rectangular, Fins |
| Length: | 0.748" (19.00mm) |
| Width: | 0.830" (21.08mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | 3.6W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 5.39°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 20.59°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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HSS-B20-NP-02 Application Field and Working Principle
Heat sinks are devices that are used to cool electronic components, and they are essential components of industrial and home electronic environments. The HSS-B20-NP-02 is an industrial-grade heat sink that can be used in a variety of applications and can manage high levels of thermal stress and dissipate heat effectively. This article will discuss the application field and working principle of the HSS-B20-NP-02.
Application Field
The HSS-B20-NP-02 heat sink is designed for industrial applications, but can also be used in home or commercial electronics. The heat sink can be used with a variety of electronic components, including servers, CPUs, graphics cards, and power supplies. The heat sink offers a range of efficient cooling solutions for these components, which helps to improve their performance and lifespan.
The HSS-B20-NP-02 also features a unique square-shaped fin design that can be highly effective in controlling the temperature of the device. The heat is evenly distributed across the surface of the fin, which helps to reduce hotspots and improve the efficiency of heat dissipation. The device also features an effective heat conduction material, which helps to transfer heat more quickly and effectively.
Working Principle
The operating principle behind the HSS-B20-NP-02 is relatively simple. The device consists of a central fan and a series of fins that are connected to a heat sink. The fan draws in hot air from the surrounding environment and then forces it through the heat sink. As the air passes through the heat sink, the fins absorb the heat and disperse it into the atmosphere, effectively cooling the electronic component.
This process of heat transfer is made more effective by the use of special thermal conductive materials, which help to transfer heat more quickly and evenly. The device also features an adjustable fan speed, which allows the user to adjust the amount of air passing through the fins and optimizing cooling performance.
Conclusion
The HSS-B20-NP-02 is an efficient and reliable industrial-grade heat sink that can be used in a variety of applications. The device features a unique fin design that helps to evenly distribute heat, and its high-performance thermal materials ensure maximum cooling efficiency. The HSS-B20-NP-02 is an effective solution for controlling the thermal stress of electronic components and ensuring their optimal performance and lifespan.
The specific data is subject to PDF, and the above content is for reference