Allicdata Part #: | HSS-B20-NP-03-ND |
Manufacturer Part#: |
HSS-B20-NP-03 |
Price: | $ 0.20 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CUI Inc. |
Short Description: | HEATSINK TO-220 3.6W ALUMINUM |
More Detail: | Heat Sink TO-220 Aluminum 3.6W @ 75°C Top Mount |
DataSheet: | HSS-B20-NP-03 Datasheet/PDF |
Quantity: | 1000 |
4000 +: | $ 0.17357 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | TO-220 |
Attachment Method: | -- |
Shape: | Rectangular, Fins |
Length: | 0.279" (7.10mm) |
Width: | 0.787" (20.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | 3.6W @ 75°C |
Thermal Resistance @ Forced Air Flow: | 7.45°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 20.83°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks are used in many applications, including cooling off electrical components, for removing excess heat, and for providing better energy efficiency. The HSS-B20-NP-03 is a special form of Heat Sink that is used for mounting and holding heat-producing electrical components in place, and it is also used to dissipate heat during the operation of electronic equipment. The HSS-B20-NP-03 is a component of the HSS (High Speed Sink) Series that provide both cost efficiency and excellent thermal performance.
Application Field of HSS-B20-NP-03
The HSS-B20-NP-03 thermal - heat sink is designed for use in consumer, industrial and communications applications, including power electronics, instrumentation and telecommunication systems. They are particularly suitable for use in areas where the operating environment has limited space. The HSS-B20-NP-03 can also be used in much more difficult thermal conditions. They are ideal for applications that require rapid heat transfer, such as high-speed computer processors, boards, and other semiconductor components. By mounting multiple HSS-B20-NP-03 on the same heat-producing device, it is possible to greatly reduce the total thermal resistance.
Working Principle of HSS-B20-NP-03
The HSS-B20-NP-03 thermal - heat sink uses conduction as its primary method of heat transfer. This means that heat is transferred directly from the electrical components to the HSS-B20-NP-03 when the heat-producing component comes into contact with the HSS-B20-NP-03’s mounting surface. The heat is then conducted away from the components to the environment through the HSS-B20-NP-03’s fins. This process of transferring the heat away from the components and into the environment is known as dissipation.
The HSS-B20-NP-03 has a built-in thermal resistance, which allows it to effectively dissipate the heat away from the components. The thermal resistance is determined by the size and shape of the HSS-B20-NP-03’s fins. The larger and more numerous the fins, the better thermal performance of the HSS-B20-NP-03 will be. Additionally, the HSS-B20-NP-03 can be designed with multiple heat-transfer paths to ensure maximum cooling efficiency.
The HSS-B20-NP-03 also works by using convection, which is the movement of air over a surface that acts as a cooling agent. The fins on the HSS-B20-NP-03 act as a large surface for convection to take place and the air over the fins is quickly drawn away from the heat-producing components. This helps to reduce the total thermal resistance of the components, allowing them to operate at lower temperatures which helps to extend the life of the components.
By using both conduction and convection, the HSS-B20-NP-03 is able to deliver excellent performance and long life expectancy. It is more efficient than air-cooled heat sinks and is less noisy, making it an ideal choice for many applications.
The specific data is subject to PDF, and the above content is for reference