HSS-B20-NP-06

Series:	--
Part Status:	Active
Type:	Board Level
Package Cooled:	TO-220
Attachment Method:	Bolt On
Shape:	Square, Fins
Length:	0.748" (19.00mm)
Width:	0.748" (19.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.375" (9.52mm)
Power Dissipation @ Temperature Rise:	2.9W @ 75°C
Thermal Resistance @ Forced Air Flow:	7.51°C/W @ 200 LFM
Thermal Resistance @ Natural:	26.32°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction

Heat sinks are devices designed to absorb and dissipate thermal energy. The HSS-B20-NP-06 is one such device specifically designed for heat dissipation. This article will explore the application field and working principle of the HSS-B20-NP-06 heat sink.

Application Field

The HSS-B20-NP-06 heat sink is particularly well-suited for devices that dissipate large amounts of heat, such as CPU processors and power amplifiers. The heat dissipation capabilities of the HSS-B20-NP-06 come from its large area of exposed surface which exposes the surrounding air to the increased heat. The HSS-B20-NP-06 is also ideal for applications that need to dissipate the heat generated by electronic devices outside of a controlled environment, such as in open-air applications.

Working Principle

The HSS-B20-NP-06 is designed to absorb and dissipate thermal energy quickly and efficiently. Heat is generated either by an internal device, such as a processor or an amplifier, or by the external environment, such as through sunlight. The HSS-B20-NP-06 is designed so that the heat from these sources will be quickly dissipated by convection. Convection is the transfer of heat between two mediums which are at different temperatures. In the HSS-B20-NP-06, heat is drawn away from an internal device as cooler air is drawn in from the outside. The heat is then dissipated into the ambient air, allowing the device to remain at an optimal operating temperature. An additional layer of heat dissipation is provided by the large fin area of the HSS-B20-NP-06. By increasing the surface area of the heat sink, the effect of convection is amplified, allowing heat to be dissipated more quickly. This design ensures that the device does not become overheated, preventing potential damage.

Conclusion

The HSS-B20-NP-06 is an excellent choice for devices that generate large amounts of heat, such as processors and amplifiers. Its design allows for efficient heat dissipation, due to convection and the large fin area of the heat sink. By dissipating heat in a timely manner, the device can remain at an optimal operating temperature, preventing potential damage.

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