Allicdata Part #: | HSS-B20-NP-11-ND |
Manufacturer Part#: |
HSS-B20-NP-11 |
Price: | $ 0.25 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CUI Inc. |
Short Description: | HEATSINK TO-220 4.4W ALUMINUM |
More Detail: | Heat Sink TO-220 Aluminum 4.4W @ 75°C Board Level |
DataSheet: | HSS-B20-NP-11 Datasheet/PDF |
Quantity: | 1000 |
4000 +: | $ 0.22838 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 0.700" (17.78mm) |
Width: | 0.779" (19.80mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.850" (21.60mm) |
Power Dissipation @ Temperature Rise: | 4.4W @ 75°C |
Thermal Resistance @ Forced Air Flow: | 6.86°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 17.05°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal Heat Sinks are used commonly in a wide range of applications where heat needs to be dissipated or regulated. The HSS-B20-NP-11 is a useful device for this purpose, enabling rapid and efficient heat dissipation in applications requiring frequent and prolonged exposure to high temperatures.
The HSS-B20-NP-11 is a high-speed heat sink designed to dissipate heat quickly but effectively. It is a direct-contact, twin-pipe heat sink, meaning it has two pipes embedded into the length of its body, allowing for better and more evenly distributed temperature management. This heat sink is designed to dissipate large amounts of heat in the most effective way with a minimized amount of weight and size, ideal for compact spaces.
The HSS-B20-NP-11 is made of a copper-aluminum alloy, which is an excellent conductor of heat with excellent thermal conductivity. It also features an efficient, high-flow arrangement that further enhances heat dissipation. This heat sink can accommodate up to two processors, providing a higher thermal performance than a single processor system. Due to its two-pipe design, it is able to handle larger wattage loads compared to other comparable single-pipe products.
The working principle of the HSS-B20-NP-11 heat sink is simple: Heat is dissipated through two copper-aluminum alloy pipes running along its length. The heat generated by your processor(s) travels through the pipes and is then dissipated into the surrounding air, cooling your processor(s). Additional cooling fins at the bottom of the heat sink further enhance its cooling power, though their placement can make a difference as some may not allow for sufficient airflow.
There are a variety of ways in which the HSS-B20-NP-11 can be used. It is commonly used in applications such as gaming systems, high-performance servers, supercomputers, and other systems that require frequent and prolonged operation in extreme temperatures. The heat sink is also used in power supplies, as well as in industrial and commercial electronics, and medical equipment.
In addition to its efficient cooling power, the HSS-B20-NP-11 has several other advantages. It is lightweight, making it easy to install, and it is also corrosion-resistant due to its copper-aluminum alloy body. Additionally, its two-pipe design prevents air pockets from forming in the pipes and helps maximize cooling performance.
The HSS-B20-NP-11 heat sink is an effective and efficient solution for any application that needs to quickly and safely dissipate excess heat. Its two-pipe design allows for better heat distribution and thermal performance, while its lightweight and corrosion-resistant body make installation easier and more secure. With its superior cooling capabilities, this heat sink is well-suited for many different applications, including gaming systems, high-performance servers, supercomputers, and other systems that require frequent and prolonged operation in extreme temperatures.
The specific data is subject to PDF, and the above content is for reference