| Allicdata Part #: | HSS-B20-NP-13-ND |
| Manufacturer Part#: |
HSS-B20-NP-13 |
| Price: | $ 0.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CUI Inc. |
| Short Description: | HEATSINK TO-220 3.9W ALUMINUM |
| More Detail: | Heat Sink TO-220 Aluminum 3.9W @ 75°C Board Level |
| DataSheet: |  HSS-B20-NP-13 Datasheet/PDF |
| Quantity: | 1000 |
| 4000 +: | $ 0.29232 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Fins |
| Length: | 0.700" (17.78mm) |
| Width: | 1.750" (44.45mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.375" (9.52mm) |
| Power Dissipation @ Temperature Rise: | 3.9W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 5.88°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 19.22°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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HSS-B20-NP-13 Application Field and Working Principle
The HSS-B20-NP-13 is a form of thermal heat sink that is designed to dissipate heat from computer components. It is used in a variety of industries including computer engineering, air conditioning and refrigeration systems, electrical engineering, and automotive. The HSS-B20-NP-13 can be used to cool components such as processors, chipsets, circuit boards, power transistors, and other electronic components.
A heat sink is a piece of hardware that disperses heat away from a device. It is typically positioned in between the device and its environment to prevent the transfer of heat through other means, such as conduction. A thermal heat sink works on the principle of forced convection. The device absorbs incoming heat from its environment and utilizes fins or raised structures to generate air turbulence which carries the heat away from the device.
The HSS-B20-NP-13 is designed for a high level of performance. It is highly efficient, lightweight and simple to use. It is composed of a heat spreader, which consists of multiple fins or pinfins, and an aluminum base, which provides structural integrity and stability. The heat spreader increases the surface area of the heat sink, which allows more heat to be dissipated from the device. This mechanism also increases the overall effectiveness of the heat sink by increasing the rate of air turbulence.
To use the HSS-B20-NP-13 as a heat sink, the device must first be securely attached to the component in question. This is usually done by means of thermal paste or thermal epoxy. The thermal paste should be applied in a thin, uniform layer, allowing the heat to transfer effectively from the component to the heat sink. The device should then be secured firmly into place, ensuring that it does not wobble or move during operation.
Once the heat sink is securely attached, the device it is designed to cool should start to dissipate heat. The raised structures on the heat spreader will create air turbulence, which moves the heated air away from the device, effectively cooling the component. As the air turbulence increases, more heat will be dissipated from the component, which will eventually reduce its temperature.
The HSS-B20-NP-13 thermal heat sink is a highly effective and reliable cooling device. It is designed for a wide range of applications and its lightweight and simple construction make it a great choice for computer engineers, air conditioning and refrigeration systems, electrical engineers, and automotive professionals. With its verified reliability and excellent performance, the HSS-B20-NP-13 makes an excellent addition to any thermal management system.
The specific data is subject to PDF, and the above content is for reference