HSS-C52-NP-SMT-TR Allicdata Electronics
Allicdata Part #:

HSS-C52-NP-SMT-TR-ND

Manufacturer Part#:

HSS-C52-NP-SMT-TR

Price: $ 0.29
Product Category:

Fans, Thermal Management

Manufacturer: CUI Inc.
Short Description: HEAT SINK, STAMPING, TO-252, 8 X
More Detail: Heat Sink TO-252 (DPak) Copper 2.1W @ 75°C Top Mou...
DataSheet: HSS-C52-NP-SMT-TR datasheetHSS-C52-NP-SMT-TR Datasheet/PDF
Quantity: 1000
10500 +: $ 0.26208
Stock 1000Can Ship Immediately
$ 0.29
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: TO-252 (DPak)
Attachment Method: --
Shape: Rectangular, Fins
Length: 0.315" (8.00mm)
Width: 0.900" (22.86mm)
Diameter: --
Height Off Base (Height of Fin): 0.400" (10.16mm)
Power Dissipation @ Temperature Rise: 2.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 10.05°C/W @ 200 LFM
Thermal Resistance @ Natural: 35.71°C/W
Material: Copper
Material Finish: Tin
Description

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Thermal - Heat Sinks

Heat sinks are devices used to absorb, dissipate, and regulate the heat produced by electronic components. The heat sinks dissipate the heat by transferring the thermal energy generated by the components to the surrounding environment. Heat sinks are commonly used in consumer electronics, automobiles, and industrial applications.

The HSS-C52-NP-SMT-TR is a thermal management component, designed to help dissipate the heat produced by high-power components. It is a thermally conductive sheet made from a lightweight aluminum alloy, covered with a special heat-dissipating surface. The sheet is designed to fit closely to the components, providing increased thermal efficiency.

The HSS-C52-NP-SMT-TR works by absorbing and dispersing the thermal energy into the surrounding environment via the sheet\'s heat sinks. The heat sinks, which are placed in contact with the component, are designed to quickly absorb the thermal energy and transfer it away from the component, thus reducing the temperature of the component. This thermal energy is then dissipated into the ambient environment via convection.

The working principle of the HSS-C52-NP-SMT-TR is based on two key principles: its superior thermal conductivity and its ability to quickly and efficiently transfer heat away from the component. The thermal conductivity of the sheet is very high, with a thermal conductivity of more than 270 W/mK. This means that the heat sink can rapidly transfer heat away from the component, cooling it down and protecting it from damage.

The HSS-C52-NP-SMT-TR is primarily used in high-power applications, such as those used in industrial and automotive applications. It is also used in consumer electronics, providing efficient and reliable heat dissipation for components such as microprocessors, graphic processing units, and other sensitive components. It can also be used in a range of domestic and office applications, providing efficient heat dissipation for PCs, laptops, printers, and other devices.

The HSS-C52-NP-SMT-TR is an impressive heat sink that is suitable for a range of applications. Its superior thermal conductivity and ability to quickly transfer heat away from the component make it an essential component in many high-power applications, where efficient heat dissipation is critical. By reducing the internal component temperature, the sheet helps to protect the component from damage while maximizing its performance.

The specific data is subject to PDF, and the above content is for reference

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