Allicdata Part #: | KX14-40K11D-E300E-ND |
Manufacturer Part#: |
KX14-40K11D-E300E |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | JAE Electronics |
Short Description: | CONNECTOR RECEPTACLE |
More Detail: | 40 Position Connector Receptacle, Outer Shroud Con... |
DataSheet: | KX14-40K11D-E300E Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | KX14 |
Packaging: | Bulk |
Part Status: | Obsolete |
Connector Type: | Receptacle, Outer Shroud Contacts |
Number of Positions: | 40 |
Pitch: | 0.031" (0.80mm) |
Number of Rows: | 2 |
Mounting Type: | Surface Mount |
Features: | Board Guide, Solder Retention |
Contact Finish: | Gold |
Contact Finish Thickness: | 3.90µin (0.099µm) |
Mated Stacking Heights: | -- |
Height Above Board: | -- |
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The KX14-40K11D-E300E connector is a mezzanine board-to-board interconnect system for devices with high density and power requirements. This connector is designed for edge type applications.
The KX14-40K11D-E300Es, with its 40 contacts and its low profile makes it ideal for space-constrained applications, such as server blades and other thin-space applications. The contacts are designed in an array pattern, which allow for easy and efficient stacking of boards.
The connectors use a modular pin array design, with pins being arranged in a grid pattern with 0.5mm pitch. The pin array design of the KX14-40K11D-E300E ensures flexibility and compactness in the board layout. This in turn maximizes the board area available to other components.
The KX14-40K11D-E300Es are perfect for applications where high power, dense packaging and robust performance are required. The connectors are designed to operate up to 16A of current, and at a voltage of up to 300VAC. The design also provides highly reliable signal integrity, durability, and EMI shielding.
In terms of its working principle, the KX14-40K11D-E300E uses a mezzanine board-to-board interconnect technology. This interconnect technology provides a high-dense interconnect solution for devices with high power requirements. The connector consists of a socket and a header, each of which contains a pin array. The header is placed on the board, and the socket is mounted on the mezzanine. The pin array in the header is connected to the corresponding pin array in the socket.
When the mezzanine is assembled on the board, the contacts in the header and the socket are forced together to create a secure connection. The interconnect is completed when the pins in the header and the sockets are inserted in the corresponding pin sockets on the board. This creates a secure connection that is resistant to mechanical stress and EMI interference.
The KX14-40K11D-E300E is an ideal connector for applications such as servers, buses, embedded systems, and other devices that require a high-density, high-power interconnect solution. The connector\'s pin array design ensures flexibility and reliability, and its low-profile design enables the board to be stacked easily and efficiently. The connector\'s modular design also makes it suitable for board-to-board applications with multiple layers.
The specific data is subject to PDF, and the above content is for reference
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