L717TSEG09POL2 Allicdata Electronics
Allicdata Part #:

L717TSEG09POL2-ND

Manufacturer Part#:

L717TSEG09POL2

Price: $ 0.48
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol Commercial Products
Short Description: CONN D-SUB PLUG 9POS VERT SOLDER
More Detail: 9 Position D-Sub Plug, Male Pins Connector
DataSheet: L717TSEG09POL2 datasheetL717TSEG09POL2 Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
100 +: $ 0.44352
Stock 1000Can Ship Immediately
$ 0.48
Specifications
Features: Grounding Indents
Backset Spacing: --
Contact Material: Copper Alloy
Wire Gauge: --
Housing Material: Thermoplastic, Glass Filled
Contact Form: Stamped
Color: --
Voltage Rating: 600V
Operating Temperature: -55°C ~ 125°C
Current Rating: 5A
Material Flammability Rating: UL94 V-0
Ingress Protection: --
Contact Finish Thickness: Flash
Contact Finish: Gold
Shell Material, Finish: Steel, Tin Plated
Series: TS
Termination: Solder
Flange Feature: Board Side (M3)
Mounting Type: Through Hole
Contact Type: Signal
Shell Size, Connector Layout: 1 (DE, E)
Number of Rows: 2
Number of Positions: 9
Connector Type: Plug, Male Pins
Connector Style: D-Sub
Moisture Sensitivity Level (MSL): --
Part Status: Active
Lead Free Status / RoHS Status: --
Packaging: Tray 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

D-Sub Connectors have become widely accepted as a reliable form of wiring connectivity in digital devices. L717TSEG09POL2 D-Sub Connectors are frequently used for applications ranging from wiring connections between motherboards and peripheral devices, to high-speed serial data transmission applications. This article will provide a comprehensive overview of the L717TSEG09POL2 application field and working principle.

The L717TSEG09POL2 is an all-in-one solution for wiring connections. It features a robust design which offers secure locking mechanism, accurate alignment and full shielding. The connectors are also shock and vibration resistant, making them suitable for a wide range of application environments.

In terms of application, the L717TSEG09POL2 is widely used for the transmission of high speed serial data. The connectors provide a secure connection that is resistant to Electromagnetic Interference (EMI). They also provide a reliable medium for transmitting data with low latency, making them ideal for applications such as Ethernet, FireWire, and USB.

When using the L717TSEG09POL2, two separate assemblies must be configured in a specific configuration. The first assembly consists of two separate metal shells, one at each end of the connector. The shells are designed to screw together, forming a secure connection between them. The two shells also feature a locking mechanism which ensures that the connector components cannot be accidentally disconnected.

The second assembly consists of an internal assembly which houses the pins and sockets. The number of pins and sockets required for the configuration will depend on the application, but typical configurations range from 9-pins to 25-pins. The pins and sockets provide a reliable electrical connection between the two shells. The internal assembly is designed to accommodate a range of cables which are suitable for various application environments.

The L717TSEG09POL2 is designed with the latest technology, making it well-suited for use in demanding environments. It provides secure shielding against EMI, providing improved performance and reliability. The connector is also resistant to shock, vibration and temperature extremes, making it suitable for a wide range of applications.

The L717TSEG09POL2 is an ideal solution for a range of digital wiring connections. It provides a secure connection that is resistant to EMI and is capable of transmitting high-speed serial data with low latency. The connector is also designed to be shock and vibration-proof, giving it excellent performance in a wide range of application environments.

The specific data is subject to PDF, and the above content is for reference

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