LCQT-QFP0.5-80 Allicdata Electronics
Allicdata Part #:

A876AR-ND

Manufacturer Part#:

LCQT-QFP0.5-80

Price: $ 5.67
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: SOCKET ADAPTER MULT PKG TO 80QFP
More Detail: IC Socket Adapter Multiple Packages To QFP Through...
DataSheet: LCQT-QFP0.5-80 datasheetLCQT-QFP0.5-80 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
17 +: $ 5.15192
Stock 1000Can Ship Immediately
$ 5.67
Specifications
Series: Correct-A-Chip®
Part Status: Active
Lead Free Status / RoHS Status: --
Convert From (Adapter End): Multiple Packages
Moisture Sensitivity Level (MSL): --
Convert To (Adapter End): QFP
Number of Pins: 80
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: --
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass
Termination Post Length: 0.236" (6.00mm)
Material Flammability Rating: UL94 V-0
Features: --
Operating Temperature: -55°C ~ 125°C
Contact Material - Mating: --
Contact Material - Post: Brass
Contact Finish Thickness - Mating: --
Contact Finish Thickness - Post: Flash
Description

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Sockets for ICs, Transistors, and Adapters are a family of hardware components used to connect integrated circuits (ICs) to boards or other types of circuits. Especially in the development of electronic and technological devices, they are the key components, as they allow one to simply mount and integrate these circuits to their system. The LCQT-QFP0.5-80 socket is a typical example of such a component.

The LCQT-QFP0.5-80 socket is a type of low profile low-cost Quad Flat Package (QFP) socket made from a combination of durable ABS plastic and metal components. Primarily used for mounting and interconnecting the integration of ICs into various electronic devices, the socket is designed to provide simple and easy-to-use plug and play features, along with superior heat dissipation and electrical properties. It is especially useful for operation in tight spaces or compact systems, such as laptop computers and compacts electronic devices. The socket also includes a complimentary set of reversing locking clips, which help ensure accurate alignment and prevent damage to the contacts. Additionally, it is designed to resist thermal fatigue and shock, and is moisture resistant.

The LCQT-QFP0.5-80 socket features a thermally efficient design in order to dissipate heat generated by ICs mounted inside the package. Its metal components provide superior thermal efficiency, ensuring that it is able to dissipate heat efficiently in order to protect the ICs from damage or malfunction. The socket is also designed to provide electrical properties to prevent noise interference and maintain perfect signal integrity in the system. The socket is designed with multiple layers, and the inner layers are coated with a dielectric material to provide electrical insulation and noise protection.

The LCQT-QFP0.5-80 socket is suitable for a wide range of applications, including consumer electronics, medical, and industrial. It can be used to replace existing old-generation sockets, or used as part of a new development project, as it offers a variety of features and performance benefits. It is designed to reduce development costs and time, allowing engineers to quickly adapt the socket for their particular use. The socket also provides many of the features and performance of much more expensive traditional sockets, making it an attractive option for many applications.

In summary, the LCQT-QFP0.5-80 socket offers a variety of features and performance benefits, which make it a suitable choic for a wide range of applications. It provides simple, easy-to-use plug-and-play features, along with superior heat dissipation and electrical properties. Moreover, its design includes multiple layers, and additional electrical insulation and noise protection. This socket is an attractive option for many development projects, as it reduces costs and development time while providing features and performance comparable to higher-end models.

The specific data is subject to PDF, and the above content is for reference

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