Series:	LP
Part Status:	Active
Lead Free Status / RoHS Status:	--
Type:	Thermally Conductive Pad
Moisture Sensitivity Level (MSL):	--
For Use With/Related Products:	LUXEON LXK8-PWxx-0024
Shape:	--

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

LP0006/01-LI2000-0.25 Application Field and Working Principle

Introduction to LED Thermal Products

Light Emitting Diodes (LEDs) are solid-state lighting sources which have seen a substantial increase in popularity over the past few years as a result of their highly efficient performance and long lasting durability. LEDs utilize a semiconductor material to convert electrical energy into visible light, and consequently produce less heat than other lighting sources such as traditional incandescent bulbs. The generation of heat, however, is an inevitable part of the LED operation and must be carefully managed in order to maintain the consistent operation and long life expectancy of these devices. Thermal management products exist to address this need and typically involve the use of materials that have greater thermal conductivity than the LED itself. Common LED thermal management products include LED heat sinks, thermally conductive adhesives, and LED cooling fans.

LP0006/01-LI2000-0.25

LP0006/01-LI2000-0.25 is an LED thermal management product designed for use in high power applications. It is a self-adhesive liquid cooling pad constructed from a solid single-component dielectric liquid and features a low thermal resistance (0.25 °C/W) and high thermal conductivity (2.0 W/(m·K)). This makes the pad suitable for applications that require efficient heat transfer from LED components to a heat dissipation device, such as a heat sink or a fan.

Application Field

The LP0006/01-LI2000-0.25 pad is designed for direct thermal contact between a heat source and a heat dissipation device in order to improve heat transfer and reduce thermal resistance. It is recommended for use in products that are exposed to harsh environments, such as those encountered in outdoor use, as the pad is resistant to moisture, corrosion, and temperatures up to 150°C (302°F).Furthermore, the pad is designed for use in applications that require high power, such as powerful LED lighting (e.g. stadium lighting) and displays. Its efficient thermal conductivity and low thermal resistance make it suitable even in applications where space is limited.

Working Principle

The LP0006/01-LI2000-0.25 pad is designed to effectively dissipate heat generated by LED components. The pad is composed of a single-component dielectric liquid and is applied directly to the component (LED) and the heat dissipation device (heat sink or fan). The pad features a low thermal resistance of 0.25 °C/W, allowing for efficient thermal energy transfer through the pad and into the heat dissipation device. In addition, the pad\'s high thermal conductivity of 2.0 W/(m·K) further enhances the heat transfer capability of the pad and reduces the thermal resistance across the thermal junction. This ensures that heat generated by the LED component is quickly transported away to the heat dissipation device, and as a result, results in improved device performance and reliability.

The specific data is subject to PDF, and the above content is for reference

Part Number	Manufacturer	Price	Quantity	Description