LPAF-30-03.0-L-06-2-K-TR Allicdata Electronics
Allicdata Part #:

LPAF-30-03.0-L-06-2-K-TR-ND

Manufacturer Part#:

LPAF-30-03.0-L-06-2-K-TR

Price: $ 7.14
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: LPAF SOCKET ASSEMBLY
More Detail: 180 Position Connector Array, Female Sockets Surfa...
DataSheet: LPAF-30-03.0-L-06-2-K-TR datasheetLPAF-30-03.0-L-06-2-K-TR Datasheet/PDF
Quantity: 1000
125 +: $ 6.48648
Stock 1000Can Ship Immediately
$ 7.14
Specifications
Series: SEARAY™ LPAF
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Array, Female Sockets
Number of Positions: 180
Pitch: 0.050" (1.27mm)
Number of Rows: 6
Mounting Type: Surface Mount
Features: Board Guide
Contact Finish: Gold
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4mm, 4.5mm
Height Above Board: 0.110" (2.80mm)
Description

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The LPAF-30-03.0-L-06-2-K-TR has been categorized under the Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) grouping. This connector family is comprised of modular connectors utilizing an array edge, allowing for flexibility ideal for board-to-board applications where design space and power consumption are a concern.

The LPAF-30-03.0-L-06-2-K-TR connector is designed for connection of two PCBs with a TR spacing of 3.0mm. It is a two-row through-hole connector with an edge length of 30.0mm. It has an SMT configuration with signal contacts, copper ground probe contacts, and latch lock contacts that make up its 60 total contacts. The contacts are made of gold and boast a current rating of 2.0A per contact. The key feature of this connector is the latch lock contact that allows for one-touch connection and ensures secure connections in even the most critical applications.

The LPAF-30-03.0-L-06-2-K-TR connector uses the SMT process to attach the connector to a PCB. This allows the connector to be mounted quickly and easily with minimal processing costs. The pin density of the LPAF-30-03.0-L-06-2-K-TR also helps save design space, as the contacts are designed to be placed with as little board space as possible.

In addition, the contact of each connector is supplemented with insulation and spring materials so that it can carry a stable and strong signal even in vibration, shock, and temperature fluctuations. The insulation materials used are made from thermoplastic polyetherimide, which is a high temperature plastic that can withstand temperatures up to 230°C. The spring material is a high copper content alloy that helps to ensure reliable contact even under high temperatures.

The LPAF-30-03.0-L-06-2-K-TR connector is an ideal solution for high density board-to-board connections. Its small footprint and flexibility, combined with its easy installation and secure connection, make it an excellent choice for applications that require durability and tight connection. Its high temperature and corrosion resistance makes it an ideal choice for any environment, from extreme temperature applications to everyday mechanical environments.

The specific data is subject to PDF, and the above content is for reference

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