LSHM-130-04.0-L-DV-A-N

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The Arrays, Edge Type, Mezzanine (Board to Board) rectangular connectors like the Model LSHM-130-04.0-L-DV-A-N have a number of possible applications and it is important to remember the different aspects of how they work in order to get the best possible results.

The design and size of the connectors are among the most important factors to consider when choosing one for a particular application. The Model LSHM-130-04.0-L-DV-A-N features a 130-pin count, 04.0mm pitch, SMT configuration, Left-hand angle and it is Gold over Nickel plated.

The main difference between the Arrays, Edge Type, Mezzanine (Board to Board) connectors and other types of edge connector designs such as FPC connectors is that the former can accommodate a greater number of contacts. The Model LSHM-130-04.0-L-DV-A-N for example is capable of supporting as many as 130 pins making it suitable for applications requiring a high pin count such as cellular modem boards and ultra-miniature computing platforms.

The main advantage of such connectors is that they require fewer separate connector parts and solder steps which makes the assembly process much simpler and faster. The number of times the PCB needs to be reflowed is also minimized making it easier to hit maximum production yields. Furthermore, as compared to more complex connector designs the Arrays, Edge Type, Mezzanine (Board to Board) connectors offer more reliable connections in terms of retention and signal integrity.

The working principle of the connector is rather straightforward. Its mezzanine style design allows the rows of contacts to mated with a mating row. The gap between them is usually filled with solder so that it creates a firm connection between them. The amount of force required to mate the two sides is quite low which allows for considerable product versatility and makes them suitable for applications in which frequent disconnects and reconnects are needed.

The main applications of the Model LSHM-130-04.0-L-DV-A-N specifically include cellular modem boards, ultra-miniature computing platforms and signal distribution boards among others. To summarize, its SMT configuration, 130-pin count, 04.0mm pitch and low-mate force makes it an ideal choice for applications requiring dependable high pin count connections.

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