LTMM-122-02-T-D-30 Allicdata Electronics
Allicdata Part #:

LTMM-122-02-T-D-30-ND

Manufacturer Part#:

LTMM-122-02-T-D-30

Price: $ 3.21
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: 2MM TERMINAL STRIPS
More Detail: Connector Header Through Hole 44 position 0.079" (...
DataSheet: LTMM-122-02-T-D-30 datasheetLTMM-122-02-T-D-30 Datasheet/PDF
Quantity: 1000
1 +: $ 2.88540
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: Flex Stack, LTMM
Packaging: Tube 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.079" (2.00mm)
Number of Positions: 44
Number of Rows: 2
Row Spacing - Mating: 0.079" (2.00mm)
Number of Positions Loaded: 43
Style: Board to Board
Shrouding: Shrouded - 4 Wall
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: 0.117" (2.97mm)
Overall Contact Length: --
Insulation Height: 0.190" (4.83mm)
Contact Shape: Square
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: --
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: Keying Slot
Operating Temperature: -55°C ~ 105°C
Ingress Protection: --
Material Flammability Rating: --
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Description

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LTMM-122-02-T-D-30 is a product of Rectangular Connectors – Headers, Male Pins. It is a member of the family of rectangular connectors that have been designed to meet high performance and reliability standards. Due to its unique design and construction, LTMM-122-02-T-D-30 is capable of interconnecting two printed circuit boards or both printed and flex circuit boards with a data rate of up to 30 million pins per second. This particular product is designed for the needs of high-speed digital and signal applications.

The working principle of LTMM-122-02-T-D-30 connectors is to electromagnetic interference (EMI) shielding and power / ground (vias) capability. It uses a foil-shielded head that provides superior shielding performance. The foil-shielded head also provides great flexibility to use a single part number on all applications with standard top and bottom contact sizes. The use of vias also allows for improved power and ground capabilities.

The applications for LTMM-122-02-T-D-30 are typically used for high-speed digital and signal interconnect with the ability to handle up to 30 million pins per second. It is ideal for a wide range of applications such as communications, data acquisition, testing, and applications in industries such as automotive, medical, and aerospace that require high-speed data rates. For example, it could be used for board-to-board, front-end-to-back-end, and front-panel-to-back-panel connections.

In conclusion, LTMM-122-02-T-D-30 is an excellent product for high-speed digital and signal applications with the ability to handle up to 30 million pins per second. It provides superior EMI shielding and power / ground (vias) capability and is ideal for board-to-board, front-end-to-back-end, and front-panel-to-back-panel connections. It is also suitable for a wide range of applications in industries such as automotive, medical, and aerospace.

The specific data is subject to PDF, and the above content is for reference

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