M39003/01-2965

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Tantalum capacitors, also known as Ta-caps, are a type of electrolytic capacitor, which are composed of a pellet of tantalum metal as anode, covered by an insulating oxide layer that acts as the dielectric, and a conductive cathode. Due to its small size, high capacitance and long life, the tantalum capacitor has become one of the most popular capacitor types in use today. The M39003/01-2965 is a surface-mount chip tantalum capacitor, designed for high frequency operation.

The M39003/01-2965 tantalum capacitor is capable of providing an exceptionally wide range of capacitance values, from 470 pF to 47,000 pF. And its designed for operating temperatures ranging from -55°C to +125°C. It is also specified to handle high-temperature reflow soldering. Capacitance stability over time is typically better than 1%.

The application field of the M39003/01-2965 tantalum capacitor is mainly used in a variety of applications in telecommunications, computers, consumer electronics, and medical electronics. In addition, the chip tantalum capacitor is highly suitable for use in high frequency applications due to its low equivalent series resistance (ESR). For example, they are often used in DC-DC converters, power supplies, phase-locked loop (PLL) circuits, high-frequency switching, and audio frequency filters.

Working Principle: The working principle of tantalum capacitors is that it stores electric energy in the form of an electric field. It is made up of two metal plates: the anode and the cathode, which are separated by a dielectric layer. A voltage applied across the plates creates an electric field, which allows electrons to flow between the plates. The amount of charge stored on the plates is proportional to the applied voltage.

The M39003/01-2965 tantalum capacitor has several advantages over other capacitor types, such as high capacitance with low ESR values, low dissipation factor, wide temperature range, high packing density and long life expectancy. Due to its characteristics, it is the ideal choice for many high frequency applications. In addition, its small size enables device integration into miniature surface-mount packages.

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