M39003/01-8270/HSD Allicdata Electronics
Allicdata Part #:

M39003/01-8270/HSD-ND

Manufacturer Part#:

M39003/01-8270/HSD

Price: $ 8.65
Product Category:

Capacitors

Manufacturer: Vishay Sprague
Short Description: CAP TANT 1.2UF 10% 75V AXIAL
More Detail: 1.2µF Hermetically Sealed Tantalum Capacitors 75V ...
DataSheet: M39003/01-8270/HSD datasheetM39003/01-8270/HSD Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
100 +: $ 7.85840
Stock 1000Can Ship Immediately
$ 8.65
Specifications
Operating Temperature: -55°C ~ 125°C
Failure Rate: D (0.001%)
Features: Military
Manufacturer Size Code: B
Lead Spacing: --
Height - Seated (Max): --
Size / Dimension: 0.185" Dia x 0.474" L (4.70mm x 12.04mm)
Package / Case: Axial
Mounting Type: Through Hole
Lifetime @ Temp.: --
Series: Military, MIL-PRF-39003/1, CSR13
ESR (Equivalent Series Resistance): --
Type: Hermetically Sealed
Voltage - Rated: 75V
Tolerance: ±10%
Capacitance: 1.2µF
Moisture Sensitivity Level (MSL): --
Part Status: Active
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

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Tantalum capacitors are a specific kind of electrolytic capacitor specifically designed for use with applications that require an extremely high capacitance and very low voltage. The M39003/01-8270/HSD capacitor is an example of such an electrolytic capacitor, and is used in a variety of different applications in order to fulfill the needs of those applications.

The M39003/01-8270/HSD capacitor is a special type of capacitor that is designed to handle both high capacitance and extremely low voltage. It is made of a tantalum metal substrate with an oxidized tantalum film that provides the dielectric material for the capacitor. The tantalum film is extremely thin and offers exceptional dielectric properties, which makes it ideal for applications requiring extremely high capacitance and extremely low voltage.

The M39003/01-8270/HSD capacitor is especially well suited for use in power supply applications, where it is used to provide a large capacitance to ground without significantly increasing the power dissipation of the power supply. It is also used in other types of applications where ultra-small packages are required, as the combination of the thin metal substrate and the thin dielectric film makes it possible to create an extremely small device. For example, the M39003/01-8270/HSD is used in the manufacture of printed circuit boards, memory chips, and other tiny electronics parts.

The device is also used in communication systems, where it is used to provide an extremely low power dissipation without compromising signal integrity or causing interference. It is also used in most modern electronic devices, including computers, cell phones, and other gadgets, where it can provide high power efficiency and energy savings.

The M39003/01-8270/HSD capacitor is essentially an electrolytic capacitor with a tantalum film dielectric. The device is comprised of a metal substrate with a tantalum film attached to it. The substrate provides the structure for the device while the dielectric film provides the electrical insulation and capacitance for the device. In use, an electric current is passed through the device\'s electrodes, which causes an exchange of electrons between them, and this exchange of electrons serves to store energy in the capacitor.

When the voltage across the electrodes is higher than the dielectric film\'s threshold, the electrons flow from one electrode to the other, which charges the capacitor. Once the voltage drops below the threshold, the charge is lost from the capacitor and must be replenished in order to store energy again. This process is repeated as the voltage is changed, and it is this repeating charging and discharging that makes it possible to create a large capacitance and extremely low voltage.

In conclusion, the M39003/01-8270/HSD capacitor is a specialized type of electrolytic capacitor that can provide extremely high capacitance and very low voltage to applications that require it. It is used in a variety of applications, including power supplies, printed circuit boards, memory chips, and communication systems, and its use is becoming increasingly common in modern electronics. The device is very efficient at storing energy and providing low power dissipation, and its unique construction makes it possible to create extremely small physical packages for various components.

The specific data is subject to PDF, and the above content is for reference

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