MCP2021P-330E/SN

Series:	--
Packaging:	Tube
Part Status:	Active
Type:	Transceiver
Protocol:	LINbus
Number of Drivers/Receivers:	1/1
Duplex:	Half
Receiver Hysteresis:	175mV
Data Rate:	--
Voltage - Supply:	6 V ~ 18 V
Operating Temperature:	-40°C ~ 125°C
Mounting Type:	Surface Mount
Package / Case:	8-SOIC (0.154", 3.90mm Width)
Supplier Device Package:	8-SOIC
Base Part Number:	MCP2021

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Introduction

MCP2021P-330E/SN is an interface - drivers, receivers, and transceivers device developed by Microchip Technology Incorporated, a leading provider in semiconductor and embedded processing solutions. The device is widely used in a wide variety of applications, ranging from automotive systems to communications, industrial automation, and consumer electronics. It provides high-speed, low-power performance and features a wide range of integrated functions such as 8-bit and 16-bit digital-to-analog and analog-to-digital converters, a 32-bit programmable timer, and a pulse-width-modulated output.

Application Fields

The MCP2021P-330E/SN is widely used in automotive applications for communication between communications controllers, vehicle body controllers, and external ISPs (Infineon System Providers). In addition, the device is often used in the powertrain and body systems of various automotive manufacturers in order to enhance the performance and reliability of these systems. The device can also be used in industrial automation applications for communication between motion controllers, device controllers, and programmable logic controllers (PLCs).In addition, the MCP2021P-330E/SN can be used in a wide range of consumer and communications applications. These applications range from Bluetooth, infrared and Ethernet communication devices to digital products such as gaming consoles and remote controlled toys.

Working Principle

The MCP2021P-330E/SN interface - drivers, receivers and transceivers device operates on a “dual layer” architecture. This architecture is composed of two layers: the Host Layer and the Device Layer. The Host Layer provides the basic control signals and frame formats for communication between the two layers. The Device Layer provides the physical connection between the two layers as well as the control and data signals for each application.The MCP2021P-330E/SN transceivers device provides a combination of differential LVDS and SSTI (Serial System Transport Interface) transceivers for both the Host and the Device layers. The MCP2021P-330E/SN receivers device provides a range of low voltage differential signaling technologies for the Host and Device layers, including SSTI, LVDS, and LVTTL (Low Voltage TTL).

Conclusion

The MCP2021P-330E/SN is a powerful and versatile interface - drivers, receivers and transceivers device, which is widely used in a variety of automotive, industrial, and communications applications. The device operates on a dual layer architecture, and provides a range of low voltage differential signaling technologies for both the Host and Device layers. This makes the device suitable for many demanding and complex applications.

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