MDB1-9SH027

Shell Material, Finish:	--
Backset Spacing:	--
Contact Material:	Copper Alloy
Wire Gauge:	--
Housing Material:	Diallyl Phthalate (DAP), Glass Filled
Contact Form:	--
Color:	--
Voltage Rating:	--
Operating Temperature:	-55°C ~ 150°C
Current Rating:	3A
Material Flammability Rating:	--
Ingress Protection:	--
Contact Finish Thickness:	--
Contact Finish:	Gold
Series:	MDB
Features:	--
Termination:	Wire Leads
Flange Feature:	Housing/Shell (Unthreaded)
Mounting Type:	Panel Mount
Contact Type:	Signal
Shell Size, Connector Layout:	0.050 Pitch x 0.043 Row to Row
Number of Rows:	2
Number of Positions:	9
Connector Type:	Receptacle, Female Sockets
Connector Style:	D-Type, Micro-D
Part Status:	Active
Lead Free Status / RoHS Status:	--
Packaging:	--

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MDB1-9SH027 Application Field and Working Principle D-sub connectors are a type of electrical connector with pins in the shape of a \'D\', which is where the name originates. The MDB1-9SH027 is a 50-way variant in the D-sub family produced by Samtec, which has specific uses mainly in the fields of computing and communications. This article explains these applications as well as the device’s working principle. Applications The MDB1-9SH027 is an ideal choice in computing-based applications that require multiple connections simultaneously. This is because its design produces the highest possible pin density in a connector. Its 50 pins allow for up to 25 differential pairs to be inserted, making it a great way to connect electronics with multiple channels of data. The other main application for the MDB1-9SH027 is for communications based applications. Its 50-pin design allows for better encryption of data by allowing extra pairs of pins to be used to form a secure connection - a necessary feature in today\'s digital world. Its benefits of high density and protection from interference make it particularly suitable for these types of applications. Working PrincipleThe working principle of the MDB1-9SH027 is based on electrical signals. It is designed to transfer high-speed differential signals, typically operating at up to 25 Gbps in its wide-band version. As such, it has a wide range of both shielding and contact materials in order to allow signal quality that does not degrade as distance is increased. The MDB1-9SH027 uses redundant shielding to reduce the impact of interference while providing superior power and signal integrity. Its stacked shield design incorporates top and bottom-shell cover shields, as well as inner stacks and ground shields. This shielding provides effective protection from electric noise and crosstalk while maintaining high-speed signal connections.Additionally, the MDB1-9SH027 features an innovative contact design that prevents signal losses through contact resistance and insertion loss. These features help to ensure the performance and reliability of the connector. ConclusionThe MDB1-9SH027 is a 50-way variant in the D-sub family of connectors produced by Samtec. It is mainly used in computing and communications applications because of its high connectivity and its high-speed signal transmission capabilities. Its multiple layers of shielding ensures that the signal quality is not compromised even when connecting two points at long distances. Thus, the MDB1-9SH027 is a great choice for any type of application that requires high-speed signal transmission and reliable connectivity.

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