Allicdata Part #: | MJSU-10PL87-ND |
Manufacturer Part#: |
MJSU-10PL87 |
Price: | $ 73.04 |
Product Category: | Connectors, Interconnects |
Manufacturer: | ITT Cannon, LLC |
Short Description: | MICRO |
More Detail: | Connector Header Through Hole 10 position |
DataSheet: | MJSU-10PL87 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 65.73170 |
Series: | MJS |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | -- |
Number of Positions: | 10 |
Number of Rows: | 3 |
Row Spacing - Mating: | -- |
Number of Positions Loaded: | All |
Style: | Board to Cable/Wire |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Threaded |
Contact Length - Mating: | -- |
Contact Length - Post: | -- |
Overall Contact Length: | -- |
Insulation Height: | 0.170" (4.32mm) |
Contact Shape: | Circular |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
Contact Finish - Post: | -- |
Contact Material: | Copper Alloy |
Insulation Material: | Polyetherimide (PEI) |
Features: | -- |
Operating Temperature: | -55°C ~ 125°C |
Ingress Protection: | -- |
Material Flammability Rating: | -- |
Insulation Color: | Natural |
Current Rating: | 3A |
Voltage Rating: | 400V |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
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MJSU-10PL87 is a rectangular connector header typically used in electronic and electrical applications. It is composed of a polyester-insulated base with an integrated mounting hole feature that provides a secure and durable connection that is usually preferred when space is limited. The product is a 5-row, 10-pin male header pin configured with a 0.1-inch pitch. It has a narrow design which allows for more efficient and cost-effective applications.
The MJSU-10PL87 features a combination of two high-quality materials including gold-plated copper and stainless steel. The gold-plated copper ensures excellent performance and effectively prevents short-circuits while the stainless steel provides superior strength and durability.
The header pins are typically used in devices requiring power, ground, control signals, and other interface lines. It is commonly found in popular electronics such as phones, tablets, laptops, processors, PCBs, and computer peripherals for their reliable connection and long-term lifespan. To further protect against environmental conditions, the MJSU-10PL87 also features a protection sealant that prevents moisture, dust, and other contaminants from entering the connection.
Working principle
The MJSU-10PL87 employs the Electro-Mechanical Push-Pull System which uses an electric current to actuate the header pin’s connector to pull or push a mating component. The header pin will extend out from the board and release a mating component when a current is supplied to pull the header pin out while a reverse current will push the component back into place.
The E-M Push-Pull system greatly improves the mating cycle of the header pins and eliminates the need for any additional manual force to securely fasten the header pins in place. The MJSU-10PL87 is designed to maintain secure contact with mating components without the risk of short-circuiting or accidental wire displacement. Additionally, it features a ratchet mechanism that prevents mating components from being pulled out unknowingly.
With its narrow design and excellent performance in tight spaces, the MJSU-10PL87 is an ideal solution for many electronic and electrical applications. Its Electro-Mechanical Push-Pull system is designed to provide a reliable connection between the header and mating component with minimal interruption from environmental fluctuations, making it a trusted option for many professionals in the electronics industry.
Overall, the MJSU-10PL87 is a high-quality rectangular connector header that offers an excellent solution for long-term power, ground, control signal, and other interface lines. Its reliable connection and long lifespan makes it a preferred choice for many crowded device configurations.
The specific data is subject to PDF, and the above content is for reference
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