MMA21-0261D1

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MMA21-0261D1 is a type of backplane connector, specifically designed for data and power application. It is made with reliable and high-speed materials to provide the ultimate payloads in terms of internal communication. It is highly compatible with Ethernet and other types of communication. The backplane connector is widely used in the military, aerospace, telecommunications and other related fields, because of its reliable performance and excellent flexibility.

The MMA21-0261D1 is designed to connect multiple modules on the backplane, allowing for secure communication between the modules. The connector offers a low-profile design to ensure that the mass of the components is minimized while providing the necessary functionality. The electrical contacts also provide good contact integrity between the modules. The multi-pin connectors are designed in accordance with the IEC 61850 standard for backplane connectors.

The working principle of the MMA21-0261D1 is based on a high-impedance coupling. This is a method that allows the electrical contacts to be separated but still transfer data and signals across the gap. The connector provides a high-speed stable connection between the modules, as well as low electromagnetic interference. In addition, the connector is also highly scalable, with multiple pins allowing for a wider range of connection possibilities.

The MMA21-0261D1 is particularly suitable for applications in the military, in aerospace, and in the telecommunications industry. It is also often used in robotics and instrumentation applications, as it offers durable performance and reliable connections. Its low profile makes it particularly suitable for single board computers, as the components can be easily integrated.

In summary, the MMA21-0261D1 is a reliable and efficient backplane connector that is suitable for a variety of applications. It has outstanding engineering features which make it perfect for use in military and aerospace applications, as well as in telecommunications and instrumentation. It is highly scalable and has a low-profile design for easy integration. It also offers high-impedance coupling and low-EMI features, making it perfect for highly sensitive devices.

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