MMD21-0181H1

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MMD21-0181H1 application field and working principle:

MMD21-0181H1 (motherboard impact-resistant high-speed connector) belongs to a new type of connectors designed for computer backplane boards. It can be classified into Backplane Connectors- Specialized series, as it is completely tailored to meet the high-speed data transfer requirements of modern PC designs. Its high-density design is well-suited for routing signals in closely spaced boards, and the connector\'s robust construction provides excellent EMI protection and excellent crosstalk performance. The MMD21-0181H1 connector is specifically designed for the Intel Corporation™ Socket 478X infrastructure to provide unprecedented throughput and reduce latency.

The MMD21-0181H1 is a 32-position, impact-resistant, high-speed mother board connector. It has a push and pull latching mechanism, and its header and receptacle bodies are characterized by their robust mechanical design. To ensure secure connection in the most extreme environmental conditions, the mating interface features a 4-position retention clip and high-endurance pressure points.

The connector employs four coaxial lines and two twisted pairs in order to provide exceptional throughput and latency performance. It has a maximum insertion force of 400 newtons at a velocity of 3 mm/s, and a minimum electrical insertion life of 10,000 cycles. The MMD21-0181H1 also features a metal reinforcing layer and a 6.0mm pitch anti-collision feature, which makes it the ideal choice for cellular base board applications.

The MMD21-0181H1 high-speed mother board connector is suitable for applications where high data throughput, latency performance, and electrical performance are important. It is commonly used in servers, telecom systems, data storage, and digital video systems. It is also suitable for many other deployments where high-end computer products are needed.

In short, the MMD21-0181H1 connector provides an ideal solution for high speed, high bandwidth, and high performance applications. Its robust mechanical, electrical, and thermal properties make it the ideal choice for system designers looking for an advanced and reliable interconnect solution.

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