MMD23-0201H1 Allicdata Electronics
Allicdata Part #:

MMD23-0201H1-ND

Manufacturer Part#:

MMD23-0201H1

Price: $ 24.86
Product Category:

Connectors, Interconnects

Manufacturer: Vishay Dale
Short Description: CONN RACK/PANEL 20POS 5A
More Detail: N/A
DataSheet: MMD23-0201H1 datasheetMMD23-0201H1 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
12 +: $ 22.58860
25 +: $ 21.64180
50 +: $ 20.28920
100 +: $ 19.61290
250 +: $ 18.53080
Stock 1000Can Ship Immediately
$ 24.86
Specifications
Series: MM22
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Receptacle, Female Sockets
Connector Style: Rack and Panel
Number of Positions: 20
Number of Positions Loaded: All
Pitch: --
Number of Rows: 3
Number of Columns: --
Mounting Type: Panel Mount
Termination: Solder Cup
Contact Layout, Typical: --
Features: Screwlocks
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Green
Current Rating: 5A
Material Flammability Rating: --
Operating Temperature: --
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

MMD23-0201H1 Application Field and Working Principle

MMD23-0201H1 (2mm Stack Height) is a type of backplane connectors specialized for applications requiring small form factor with a space-saving design. This type of backplane connectors is especially fit for densely packed boards and multi-layered board designs and comes in a variety of configurations and accessories.

The MMD23-0201H1 backplane connector features a high-reliability, space-saving 2mm stack height design, optimized for high signal integrity in high speed digital applications. This innovative design allows for minimal stray coupling and interference at higher frequencies, providing strong reliability and system performance. This backplane connection also features a housing with robust connection capability that prevents grounding issues.

These backplane connectors are suitable for vertical and side-mount applications and feature an improved retention force for reliable connections. It consists of two rows holding different pins and has two rows with eight contacts. It is available in a variety of single-contact and multi-contact configurations to suit various applications like backplane systems, cabinets, peripherals, test and measurement, etc. This connector allows multiple signals within the same pair, making it suitable for a wide range of applications like gigabit ethernet, FireWire, fibre optics, etc.

The MMD23-0201H1 offers secure, long-term, reliable connections and is designed such that there are no points of contact between the socket and the board. The pin and contact design is optimized to provide high contact density and low-resistance which ensures no contact problems. Its unique design also enables easy insertion and smooth providing of mating action for good reliability.

This backplane connector features a high durability, featuring a standard mechanical locking mechanism for robust connection integrity. Shielding is also available for additional protection against EMI and RFI interference. The shielded variant operates at a broad frequency range (up to 4GHz) to increase signal integrity and reduce crosstalk and impedance mismatches.

Although the MMD23-0201H1 features a small design, it is extremely reliable with a high performance, due to its robust design and innovative features. It offers optimum performance in applications requiring high speed data rates and low crosstalk, with an enhanced signal integrity. This type of backplane connection can be used in applications where space is at a premium and rugged operations are needed.

In summary, the MMD23-0201H1 backplane connection offers reliable and secure connection solutions in applications with high speed data rates needing minimum space. Its special designs make it suited for densely packed boards, multi-layered board designs, and different peripheral and control systems. It is also suitable for EMI and RFI shielding applications, offering robust contact and mechanical integrity.

The specific data is subject to PDF, and the above content is for reference

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