MMD21-0291K1

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Backplane Connectors are specialized electrical connectors that are used to transfer data, signals, and power from one device to another. The MMD21-0291K1 is a specialized backplane connector that is typically used in a variety of industries, including industrial automation, data center/server applications, telecommunications, medical equipment, and automotive. It is designed to provide a reliable and efficient signal and power connection within a high-density, miniaturized chassis.

The MMD21-0291K1 is a multilayer power and signal connector that is made up of three main components – the board stack, the housing, and the contact system. The board stack is comprised of three laminated layers – the upper and lower layers are signal layers and the middle layer is used to provide solid ground. The contact system is made up of two board-to-board (B2B) channels that are located in the housing. The pins on the B2B channels can be used to transfer data, signals, and power between boards.

The MMD21-0291K1 has a number of features that allow it to be used in a variety of applications. For example, the B2B channels are designed to provide high-power point-to-point and redundant redundant connections. The contact system has built-in heat sinks to dissipate heat and improve the overall connection endurance. Additionally, the contact system is designed to have a low profile which allows for higher densities. The connector also has solderable contacts which make installation and replacement easy.

The working principle of the MMD21-0291K1 backplane connector is relatively simple. When two boards are connected, the pins on the B2B channels make electrical contact with each other, allowing for power and data to be transferred. The power is then distributed throughout the board’s components and the data is transmitted through the pins. The connector also provides protection from electrical interference, ensuring that the signal and power connections are reliable.

The MMD21-0291K1 is a specialized backplane connector that is often used in industrial automation, data center/server applications, telecommunications, medical equipment, and automotive applications. It has a number of features that make it an ideal choice for high-density applications, including built-in heat sinks, low profile, solderable contacts, and redundant redundant connections. Additionally, its working principle is relatively simple, making it an efficient connector for power and data transfer.

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