Allicdata Part #: | MPC8560CPX667JB-ND |
Manufacturer Part#: |
MPC8560CPX667JB |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | NXP USA Inc |
Short Description: | IC MPU MPC85XX 667MHZ 783FCBGA |
More Detail: | PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-... |
DataSheet: | MPC8560CPX667JB Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Ethernet: | 10/100/1000 Mbps (2) |
Base Part Number: | MPC8560 |
Additional Interfaces: | I²C, PCI, RapidIO, SPI, TDM, UART |
Supplier Device Package: | 783-FCPBGA (29x29) |
Package / Case: | 784-BBGA, FCBGA |
Security Features: | -- |
Operating Temperature: | -40°C ~ 105°C (TA) |
Voltage - I/O: | 2.5V, 3.3V |
USB: | -- |
SATA: | -- |
Series: | MPC85xx |
Display & Interface Controllers: | -- |
Graphics Acceleration: | No |
RAM Controllers: | DDR, SDRAM |
Co-Processors/DSP: | Communications; CPM |
Speed: | 667MHz |
Number of Cores/Bus Width: | 1 Core, 32-Bit |
Core Processor: | PowerPC e500 |
Part Status: | Obsolete |
Packaging: | Tray |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Embedded - Microprocessors
MPC8560CPX667JB is an integrated system-on-chips (SOCs) for embedded applications. It is a low-power, cost-effective device manufactured by a global leader in embedded computing solutions, Freescale Semiconductor. It provides a comprehensive feature set and a user-friendly environment that makes it an ideal choice for embedded applications.
The MPC8560CPX667JB SOCs offer a dual-core processor that has two PowerPC core processor designs - the e500 and the e5500 cores. The e500 core is an enhanced version of Freescale\'s e500 architecture. It has a high-performance Level 1 on-chip cache as well as an advanced memory system that can support multiple memory domains and high-speed memory accesses. The e5500 core offers DDR3 memory support, higher operating frequencies, and a more powerful internal core structure. Both cores have symmetric multi-processing (SMP) support and can be combined together to provide an extra layer of performance and flexibility.
The MPC8560CPX667JB chip offers advanced features, such as an on-chip PCIe 2.0 and Gigabit Ethernet, enabling high-speed connectivity. It also provides integrated technologies to support the latest embedded applications. These solutions include on-chip flash, DDR3 memory support, and a secure boot feature. In addition, the device provides a range of peripherals and interfaces, such as IDE, SATA, USB, UART, and NAND interfaces.
The MPC8560CPX667JB chip provides an ideal solution for embedded applications that require cost-effective, low-power performance. With its comprehensive feature set and powerful core architectures, it is an excellent choice for embedded system applications that require high performance and low power consumption. In addition, its advanced features, such as PCIe 2.0 and the secure boot feature, make it a suitable solution for development of embedded applications.
The working principle of MPC8560CPX667JB is quite simple. The chip is designed to act as a bridge between the embedded systems, processors, and memory. It works by providing a connection between the embedded systems, processors, and memories. It is composed of two general-purpose processors, a dedicated memory controller, and several dedicated on-chip peripherals. The two general-purpose processor cores are used to run the applications. The memory controller is used to manage the memory accesses, while the dedicated on-chip peripherals are used to provide the necessary connectivity to external components.
The MPC8560CPX667JB chip makes the embedded design process easy by providing an easy-to-use interface. It can be configured easily with the help of the on-chip peripherals and the dedicated integrated development environment. The device provides an integrated debug support option, allowing fast and effective debugging. This makes the development process efficient and reduces time-to-market.
The MPC8560CPX667JB chip is widely used in the embedded industry for various applications such as network security, industrial automation, automotive systems, home electronics, and medical equipments. In addition, the device provides reliable and high-performance support for the latest embedded applications such as those used in smartphones, tablets, and smart TVs. The device can also be used for embedded system prototyping, development of embedded solutions, as well as for high-performance computing applications.
The specific data is subject to PDF, and the above content is for reference
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