MSG5AP-1Y1-S Allicdata Electronics
Allicdata Part #:

MSG5AP-1Y1-S-ND

Manufacturer Part#:

MSG5AP-1Y1-S

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Souriau
Short Description: MSG 3U PLUGS
More Detail: N/A
DataSheet: MSG5AP-1Y1-S datasheetMSG5AP-1Y1-S Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: --
Voltage Rating: --
Operating Temperature: -40°C ~ 100°C
Material Flammability Rating: --
Current Rating: --
Color: --
Contact Finish Thickness: 16.0µin (0.41µm)
Contact Finish: Gold
Features: --
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Panel Mount, Through Hole
Series: MSG 3U
Number of Rows: 2
Pitch: --
Number of Positions Loaded: All
Number of Positions: 20
Connector Style: --
Connector Type: Plug, Female Sockets
Connector Usage: --
Moisture Sensitivity Level (MSL): --
Part Status: Discontinued at Digi-Key
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The MSG5AP-1Y1-S is a specialized backplane connector used for connecting a variety of devices or components in a backplane arrangement. It is an ideal choice when space is limited and a higher level of reliability is needed. The MSG5AP-1Y1-S is commonly found in the medical, industrial, and aerospace industries, as well as in some consumer applications.

The MSG5AP-1Y1-S is a high-density backplane connector that offers a high degree of flexibility in connecting multiple devices. It has been designed to be as reliable as possible while providing maximum space savings. The use of an exclusive spring contact design allows the contacts to flex and self-adjust for optimal performance.

The MSG5AP-1Y1-S has a large number of pins arranged in a single-row format. The pins are made from a gold-plated copper alloy and offer a high level of reliability. They are also insulated to prevent danger to personnel or equipment. The insulation also helps to keep the pins in place, reducing any chance of them bending or breaking.

The MSG5AP-1Y1-S is designed to meet the demands of various applications. Its unique design provides low insertion and withdrawal forces, making it suitable for high-vibration scenarios. It also has a low profile, allowing for it to fit in tighter spaces where other connectors may not fit. Additionally, the high and low high-speed performance up to 4.25 Gbp/s makes the MSG5AP-1Y1-S the ideal backplane connector for applications requiring data transfer speeds.

The MSG5AP-1Y1-S is a versatile backplane connector that can be used in a variety of configurations. It can be used as a stand-alone connector to connect devices in a linear fashion, or it can be used to form a matrix configuration with many devices connected in a cross-over fashion. This allows for flexible network architectures for backplane applications.

The working principle of the MSG5AP-1Y1-S is based on a spring force contact system. The contacts are made from a gold-plated copper alloy with insulation to protect the contacts from environmental hazards and to help keep the pins in place. The connectors are designed to flex as the pins are inserted and withdrawn, providing consistent performance and reducing wear and fatigue. Both the insertion and withdrawal forces are low, ensuring a superior connection.

In conclusion, the MSG5AP-1Y1-S is a high-density, high-reliability backplane connector. It can be used in a variety of applications in the medical, industrial, and aerospace industries, as well as in some consumer applications. It has a wide range of features and a low profile design that makes it ideal for tight spaces. Its spring force contacts provide low insertion and withdrawal forces, while its ability to carry high-speed data makes it ideal for applications that require data transfer up to 4.25 Gbp/s.

The specific data is subject to PDF, and the above content is for reference

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