MT9HTF12872PY-53EA1

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Memory modules are essential components used to connect memory components with microprocessors and permit the processor to access the stored data. The MT9HTF12872PY-53EA1 is a 3D TSV DRAM module that is designed for mobile applications like smartphones, tablets and notebooks.

Design and Features

The MT9HTF12872PY-53EA1 is a high-density 3D Stacked Transistor-Transistor Logic (TTL) DRAM module with a total capacity of 12GB. The module is based on 512Mb 3D-stacked die and uses 1.2V DDR3L technology. It is designed to meet the high-speed requirements of modern mobile devices, including smartphones, tablets, and notebooks.

The module is also equipped with several advanced features to improve performance. It features advanced error-correcting code (ECC) algorithms to reduce errors, low-power and high-speed data transfer for improved performance, as well as a variety of other features.

Application Field and Working Principle

The MT9HTF12872PY-53EA1 is an ideal choice for mobile applications due to its high-speed and low power consumption. It is designed to support high-end applications like graphics, gaming and multimedia on mobile devices. It is also suitable for use as a bootable memory module for embedded systems, and other industrial automation applications.

The module works by transferring data between the memory and the microprocessor when a read or write instruction is sent. The latency time for a read or write instruction is usually very low and is determined by several factors, including the operating frequency, the amount of data to be transferred, and the memory size. The module also supports Error Correction Codes (ECCs) to ensure data accuracy and reliability.

Advantages

The MT9HTF12872PY-53EA1 has several advantages over other memory modules. It has a very low power consumption, which makes it suitable for use in power-constrained devices. Its 3D-stacked design also increases the memory density to 12GB, and its advanced ECC algorithms reduce errors. It also has good performance and is capable of handling large amounts of data.

Conclusion

The MT9HTF12872PY-53EA1 is a high-density 3D-stacked DRAM module designed for mobile applications. It has several advanced features for improved performance and reliability. It is suitable for high-end applications like multimedia, gaming and graphics, as well as bootable memory modules for embedded systems. It also offers low power consumption and good performance for data intensive tasks.

The specific data is subject to PDF, and the above content is for reference