NON-75

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

NON-75 technology has been gaining a lot of momentum in recent years as an advanced method for fabricating integrated circuits and other semiconductor devices. The NON-75 method is unique in that it uses a non-contact physical vapour deposition technique to deposit a material onto a prepared surface. This method can be used to create a wide range of integrated circuit components such as capacitors, transistors, resistors, and other integrated devices.

The NON-75 technology is based on three distinct processes. The first is a sputtering process in which ionized particles are generated using a direct current source that is used to strike a target material. The second is a vapor condensation process in which vaporized material is used to form a thin film of material on the substrate. Finally, a diffusion process is used to fabricate the integrated components on the substrate.

The application of NON-75 technology is varied, and the technology has been used to produce a wide variety of products such as optical components, MEMS components, RF components, and other components that require the deposition of thin films. In addition, NON-75 technology can be used in applications such as chemical vapor deposition, laser annealing, and PVD deposition. In these applications, NON-75 technology can be used to create metal films, dielectrics, polymers, and other materials for use in these applications.

The working principle of NON-75 technology is relatively simple. In the sputtering process, the target material is bombarded with a high-energy direct current source. This causes the target material to break down into smaller particles that are very small in size. These particles are then used to form thin films on the substrate. In the vapor condensation process, the vaporized material is deposited on the substrate and then condensed, forming a thin film.

Finally, the diffusion process is used to create the integrated components. In this process, the particles are subjected to an electric field, which causes them to move towards the substrate. This process then creates the desired components on the substrate, such as transistors, capacitors, or resistors. Once all of these components are formed, the entire integrated circuit can then be tested and verified for functionality.

NON-75 technology has a wide range of application possibilities and has been used to fabricate many types of integrated circuits and other semiconductor devices. The processes used to create these components are relatively simple and straightforward, and the results can be highly reliable. With its high-precision deposition capabilities, this technology is likely to become even more prevalent in the next few years.

The specific data is subject to PDF, and the above content is for reference