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LED Thermal Products

The NX301104 offers the next generation of LED Thermal products that are essential for high efficiency and performance in lighting applications. This product is an electrically conductive molding resin that is designed to improve the heat dissipation of LED packages. The heat dissipation is enhanced by creating a thermal boundary between metal and resin components of the package.

Application field

The NX301104 is suitable for a variety of applications due to its low thermal resistance properties and is ideal for use in LED lighting for automotive, personal electronics, industrial, and retail applications. The product’s low profile allows for easy integration into existing systems and can be installed in any orientation for maximum performance. Additionally, the NX301104 is lead-free and RoHS compliant.

In automotive applications, the product is highly effective in dissipating the heat created by the LEDs in turn signals and fog lights. The heat dissipation increases overall LED performance while providing a more efficient method of cooling to keep components from overheating. In personal electronics applications, heat dissipation is essential for optimal performance in portable devices such as smartphones and PDAs where the need for efficient thermal management is critical. The NX301104 also helps dissipate the heat generated by LEDs in TV backlights and video display backlights.

For industrial LEDs, the NX301104 is well-suited for use in flood lighting, ceiling lighting, light racks, and other LED systems. In addition, the product can be used in retail applications such as illuminated signs and displays. Its high thermal dissipation properties make the NX301104 suitable for any environment where LEDs are used.

Working Principle

The working principle of the NX301104 is based on the transfer of thermal energy from an LED package to the surrounding environment using low thermal resistance. The product is a thermally conductive (TC) resin, which has a high thermal conductivity that helps to dissipate heat from the LED package. The product also has a high adhesion strength, allowing it to bond to the LED package components for increased thermal performance. The package is also designed to reduce thermal resistance and increase thermal diffusion.

In operation, the heat is absorbed from the LED package and transferred through the thermally conductive resin body. The heat is then dissipated to the surrounding environment via air convection and thermal conduction. The product’s efficient performance helps to ensure the long-term reliability of the system, while also allowing for better thermal control and improved performance.

Overall, the NX301104 is an ideal solution for applications where efficient heat dissipation is necessary for ideal performance and extended life. The product can be used in a variety of LED lighting applications in automotive, personal electronics, industrial and retail applications. It offers an efficient way to improve the thermal performance of LED packages while ensuring long-term reliability of the system.

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