Allicdata Part #: | 296-28037-ND |
Manufacturer Part#: |
OMAPL138BZCE3 |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Texas Instruments |
Short Description: | IC MPU OMAP-L1X 375MHZ 361NFBGA |
More Detail: | ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-B... |
DataSheet: | OMAPL138BZCE3 Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Ethernet: | 10/100 Mbps (1) |
Base Part Number: | OMAP-L138 |
Additional Interfaces: | HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART |
Supplier Device Package: | 361-NFBGA (13x13) |
Package / Case: | 361-LFBGA |
Security Features: | Boot Security, Cryptography |
Operating Temperature: | 0°C ~ 90°C (TJ) |
Voltage - I/O: | 1.8V, 3.3V |
USB: | USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
SATA: | SATA 3Gbps (1) |
Series: | OMAP-L1x |
Display & Interface Controllers: | LCD |
Graphics Acceleration: | No |
RAM Controllers: | SDRAM |
Co-Processors/DSP: | Signal Processing; C674x, System Control; CP15 |
Speed: | 375MHz |
Number of Cores/Bus Width: | 1 Core, 32-Bit |
Core Processor: | ARM926EJ-S |
Part Status: | Obsolete |
Packaging: | Tray |
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The OMAP-L138 BZCE3 is a highly advanced embedded microprocessor designed for a wide range of applications. It is a combination of various Texas Instruments technologies and components, packed into a single chip. This chip provides a powerful solution for industrial, network, and consumer products. By integrating a dedicated processor core, multiple peripherals, and sophisticated on-chip memory, the OMAP-L138 BZCE3 provides powerful processing and communication capabilities for embedded applications.The OMAP-L138 BZCE3 is designed for use in applications such as industrial automation, automotive, digital media and consumer markets. It combines an ARM926EJ–S processor core, a 64Kb L1 instruction cache, 32Kb L1 data cache and DSP Subsystem. The ARM926EJ–S processor core is supplemented with enhanced instruction set and efficient usage of the cache memories to allow for high performance data acceleration. Additionally, the OMAP-L138 BZCE3 is also integrated with rich peripheral functionality such as CAN, Ethernet, EMAC, HDQ, LP UARTs, SD/MMC, LCDC, EDMA3CC, McBSP, dual timer and USB that support communication with external devices, making it suitable for multi-application and multi-platform designs. The OMAP-L138 BZCE3 provides an enhanced memory interface which can accept 16/32/64 bit multiplexed address/data buses. It is also capable of handling both synchronous and asynchronous flash and SRAM memories. Moreover, the OMAP-L138 BZCE3 comes with an advanced memory controller that supports flat, burst and hyper-burst architectures. It also contains a two-channel packet data conduit, which reduces memory transaction time. This is particularly useful for multi-thread applications that require multiple reads/writes to the same memory and data pre-fetching.In addition to its powerful processor core, the OMAP-L138 BZCE3 contains a host of other features that make it ideal for embedded applications. For example, the chip includes an RTC that allows real-time clock operations, a watchdog timer for system monitoring, an interrupt controller for peripheral and program interrupt handling, a power management module for power saving and a boot ROM for BIOS operations. The OMAP-L138 BZCE3 also features a 32-bit loadable external unit (e.g. DMA) which can be used for making data transfers between external devices and embedded memory such as SRAM or flash. Additionally, the OMAP-L138 BZCE3 provides enhanced debug capabilities with a trace port for monitoring of system and software operation, hardware breakpoints for better program debugging, and a JTAG port for on-chip code execution.In conclusion, the OMAP-L138 BZCE3 is a highly advanced embedded microprocessor that is suitable for a wide range of applications. Its combination of powerful processor core, on-chip memory and sophisticated peripherals make it an ideal choice for embedded applications. It also provides enhanced debugging and power management capabilities that make it easier to develop and maintain complex embedded applications.
The specific data is subject to PDF, and the above content is for reference
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