PA1-1CB

Series:	PA1
Part Status:	Active
Type:	Board Level
Package Cooled:	TO-126, TO-127, TO-220
Attachment Method:	Bolt On
Shape:	Rectangular, Fins
Length:	0.710" (18.03mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	28.80°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

The PA1-1CB is a passive heat sink designed for high power engineering applications and electronic systems. It features an aluminum alloy body with a dual finned design for maximum heat conductivity and air cooling. The PA1-1CB is an ideal device to dissipate heat away from expensive or sensitive components in order to ensure reliable and efficient operation.The working principle of the PA1-1CB is based on air cooling. The device’s dual finned design aids in efficiently transferring heat away from the component being cooled by transferring it to the ambient air. This air cooling allows heat to travel from the component to the heatsink, through the fins, and out into the atmosphere. The larger surface area of the Extended Area, together with the increased air flow, leads to improved cooling performance. Moreover, the PA1-1CB is designed to ensure that the airflow is directed along the component being cooled instead of away from it, allowing for an efficient and more uniform temperature distribution.The PA1-1CB is designed for use in a variety of power engineering applications such as LED displays, servers, and also high-power electronics. It is very effective in applications where it is necessary to dissipate power efficiently and safely. This makes the PA1-1CB an ideal solution for avoiding thermal damage and improving system performance. Additionally, it is perfectly compatible with multiple power technologies and can be quickly and easily installed through the use of highly secure mounting hardware.In conclusion, the PA1-1CB is the perfect solution for applications requiring a method of dissipating power whilst avoiding thermal damage. Its dual finned design ensures high efficiency and uniform air distribution, resulting in improved performance and reliability. Additionally, its compatibility with various power technologies makes it the perfect fit for a multitude of different power engineering applications. Therefore, the PA1-1CB is the ideal solution for anyone looking for a reliable and cost effective way of dissipating power from sensitive electronic components.

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