Allicdata Part #: | 1168-1386-ND |
Manufacturer Part#: |
PH3-100-100-0.21-1A |
Price: | $ 5.08 |
Product Category: | Fans, Thermal Management |
Manufacturer: | t-Global Technology |
Short Description: | IR HEAT SPREADER/EMITTER W/ADH |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper... |
DataSheet: | PH3-100-100-0.21-1A Datasheet/PDF |
Quantity: | 11 |
1 +: | $ 4.61790 |
10 +: | $ 4.49316 |
25 +: | $ 4.24368 |
50 +: | $ 3.99407 |
100 +: | $ 3.74447 |
250 +: | $ 3.49483 |
500 +: | $ 3.24521 |
1000 +: | $ 3.18280 |
Series: | PH3 |
Part Status: | Active |
Type: | Heat Spreader |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Adhesive |
Shape: | Square |
Length: | 3.937" (100.00mm) |
Width: | 3.937" (100.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.008" (0.21mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Copper |
Material Finish: | Polyester |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal – Heat Sinks have many applications that span a variety of industries, from small home devices to large scale industrial equipment. The thermal characteristics of a heat sink are vitally important, as they can significantly affect the efficiency and safety of any given system or device. The PH3-100-100-0.21-1A is a type of thermal – heat sink, featuring a large surface area and an even more impressive thermal conductivity. In this article we will look at the application field and working principle of this particular thermal – heat sink.
The most common application field for the PH3-100-100-0.21-1A is on electrical and computer systems, as their large surface area and high thermal conductivity make them ideally suited for this application. This is because they are able to dissipate heat quickly and efficiently, as they are highly thermally conductive and can dissipate heat evenly. This makes them ideal for applications such as data centers, high performance computing systems, and advanced electronic equipment, where their thermal characteristics can improve system reliability and performance. Additionally, due to their low cost and high thermal performance, they are also suitable for applications such as air conditioners, refrigerators, and automotive systems.
The principle of the PH3-100-100-0.21-1A works off of the concept of heat transfer. As heat is generated, it is transferred from one surface to another through thermal radiation, conduction and convection. This transfer of heat maintains an equilibrium between the two surfaces, allowing heat to dissipation into the environment. The PH3-100-100-0.21-1A’s large surface area allows for a higher rate of heat transfer, allowing heat to be dissipated faster and more efficiently.
The heat sinks purpose is to transfer heat away from sensitive components in an efficient and reliable manner. Heat can be transferred to the environment through convection and radiation, meaning that the air around the components can act as a heat sink. The addition of the PH3-100-100-0.21-1A heat sink significantly increases this natural heat dissipation process, as the heat sink dissipates heat much faster than air. Additionally, the heat sink has a large surface area, meaning that it can dissipate more heat in a given period of time.
Thermal - Heat Sinks, like the PH3-100-100-0.21-1A, provide an efficient and reliable way to dissipate heat away from sensitive components. The heat sink is able to transfer heat through radiation and convection, and its large surface area allows for more rapid and efficient heat dissipation. The PH3-100-100-0.21-1A is most often used in electrical and computer systems, but is also suitable for other applications such as air conditioners, refrigerators, and automotive systems. As such, the PH3-100-100-0.21-1A provides a reliable and efficient solution in a variety of applications.
The specific data is subject to PDF, and the above content is for reference