Allicdata Part #: | 1168-2073-ND |
Manufacturer Part#: |
PH3-101.6-38.1-0.21-1A |
Price: | $ 2.09 |
Product Category: | Fans, Thermal Management |
Manufacturer: | t-Global Technology |
Short Description: | PH3 101.6X38.1X0.21MM |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper... |
DataSheet: | PH3-101.6-38.1-0.21-1A Datasheet/PDF |
Quantity: | 101 |
1 +: | $ 1.90260 |
10 +: | $ 1.85472 |
25 +: | $ 1.80432 |
50 +: | $ 1.70415 |
100 +: | $ 1.60392 |
250 +: | $ 1.50368 |
500 +: | $ 1.45356 |
1000 +: | $ 1.30319 |
Series: | PH3 |
Part Status: | Active |
Type: | Heat Spreader |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Adhesive |
Shape: | Rectangular |
Length: | 4.000" (101.60mm) |
Width: | 1.500" (38.10mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.008" (0.21mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Copper |
Material Finish: | Polyester |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are a crucial element of modern technology, enabling us to effectively dissipate heat from sensitive electrical components and maintain them at steady, stable operating temperatures. The PH3-101.6-38.1-0.21-1A is a heatsink designed to offer superior heat dissipation and reliable, long-term performance in a wide range of computing, A/V, communications, automotive, and industrial electronics applications. Let\'s learn more about the application field and working principle of the PH3-101.6-38.1-0.21-1A.
Applications
The PH3-101.6-38.1-0.21-1A is a versatile heat sink with widespread applications. It is suitable for use in a variety of computing, A/V, communications, automotive, and industrial electronics applications. In each of these sectors, it can be used for various tasks including cooling electronics components, increasing heat dissipation from devices, and reducing the operating temperature of devices.
In computing applications, the PH3-101.6-38.1-0.21-1A is useful for cooling processors, mainboards, power supplies, and other sensitive components on PCs and servers. In A/V applications, it can be used to successfully dissipate heat from audio and video components like amplifiers, receivers, pre-amps, mixers, media players, and digital-to-analog (D/A) converters. It is also suited for cooling automotive components, such as ECUs, engine controllers, mass airflow sensors, and so on. Lastly, it can ensure efficient heat dissipation in industrial electronics, particularly in setups requiring high thermal stress.
Working Principle
The main purpose of a heat sink is to increase the surface area available for the dissipation of heat. With better overall thermal conductivity, the PH3-101.6-38.1-0.21-1A\'s fins spread the heat across a larger area, ensuring efficient heat dissipation. It is constructed from high-grade aluminum with a natural aluminum surface finish. Aluminum is chosen as a heat sink material due to its excellent thermal conductivity, high workability, low weight, and high strength-to-weight ratio. The air-flow resistance is also minimized due to the combination of the natural aluminum surface finish and a shallow fin pitch.
The PH3-101.6-38.1-0.21-1A\'s fin shape is optimized for efficient heat dissipation. Its relatively short, light fins have optimized side wall inclination angles to facilitate efficient heat-sink assembly with minimal additional components. Its 6mm fins are densely spaced for optimum dissipation, resulting in a low air-flow impedance, and a low thermal resistance. Additionally, the fin shape is designed to reduce the stresses involved during assembly, as it easily deforms during contact with a mating surface.
In addition to its superior heat dissipation capabilities, the PH3-101.6-38.1-0.21-1A also offers fast thermal mount capability, helping it deliver reliable, long-term performance. Its slim profile and short fins make it suitable for use in a wide range of applications while its solder-less construction enables it to be easily integrated in system designs.
Conclusion
The PH3-101.6-38.1-0.21-1A is a versatile heat sink that enables efficient heat dissipation across a large surface area. The fin design is optimized to reduce air-flow impedance, while the aluminum construction ensures superior thermal conductivity. Suitable for use in a wide range of applications, it offers superior heat dissipation and reliable, long-term performance, proving to be a crucial element of modern technology.
The specific data is subject to PDF, and the above content is for reference