PH3-222-165-0.21-1A

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Thermal-Heat Sinks: PH3-222-165-0.21-1A Application Field and Working Principle

Heat sinks are passive thermal systems used in many electronic devices to dissipate heat and regulate the temperature of electronic components and modules. The PH3-222-165-0.21-1A is a type of heat sink designed to provide thermal management for high-power devices such as medical and automotive products, power converters, and renewable energy systems.

The PH3-222-165-0.21-1A is available in different models with varying parameters such as the number of fins, pin height, length and thickness as well as material used. When applied to a given device, the PH3-222-165-0.21-1A heat sink functions to move heat from the device to the environment via a process referred to as convection. This process is also known as forced convection; it is created by a pump, fan, or other mechanical device to maximize heat transfer. This process is sometimes referred to as the “free air” mode of operation since heat is passively transferred from the device to the atmosphere without additional conductive materials.

In order to maximize the performance of the PH3-222-165-0.21-1A heat sink, its outer surface must be designed in such a way that heat transfer is as efficient as possible. The number, size, and shape of the fins that comprise the heat sink form an important part of the design as the number of fins, their thickness, and the geometry of the fins determine how quickly the heat can be transferred from the electronic device to the environment.

In terms of its thermal efficiency, the PH3-222-165-0.21-1A model comes with a minimum operating temperature of 40°C, with the resistance of the copper fins ranging from 0.19 to 0.25°C/W. This enables the PH3-222-165-0.21-1A to fit applications involving sensitive electronics such as medical equipment that must function within a specific temperature range.

In addition, the PH3-222-165-0.21-1A heat sink is built with natural convection, meaning it does not require an additional fan or other device to increase heat transfer efficiency. This allows the PH3-222-165-0.21-1A to be used in applications where space is limited or noisy fans are not possible. In addition, its design allows for quick and easy installation, which is important for many electronic applications.

The PH3-222-165-0.21-1A is also designed to be very durable and can withstand extreme temperatures. For example, it can operate at temperatures up to 190°C while still providing a high performance level. The PH3-222-165-0.21-1A also has a long life span, as it can withstand thermal vibration, shocks, and vibration-induced fatigue. This makes it an excellent choice for applications such as medical and automotive products that require high-reliability and long-lasting performance.

In conclusion, the PH3-222-165-0.21-1A is a reliable and durable heat sink that provides excellent thermal management for high-power electronic devices. Its natural convection efficiency and high performance level make it suitable for many applications, and its superior durability ensures long-term performance. Therefore, the PH3-222-165-0.21-1A is a great choice for various applications that require reliable thermal management and optimal performance.

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