PH3-50.8-12.7-0.21-1A Allicdata Electronics
Allicdata Part #:

1168-2068-ND

Manufacturer Part#:

PH3-50.8-12.7-0.21-1A

Price: $ 0.40
Product Category:

Fans, Thermal Management

Manufacturer: t-Global Technology
Short Description: PH3 50.8X12.07X0.21MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper...
DataSheet: PH3-50.8-12.7-0.21-1A datasheetPH3-50.8-12.7-0.21-1A Datasheet/PDF
Quantity: 16
1 +: $ 0.35910
10 +: $ 0.34083
25 +: $ 0.32357
50 +: $ 0.31513
100 +: $ 0.31091
250 +: $ 0.28960
500 +: $ 0.27256
1000 +: $ 0.24701
5000 +: $ 0.23849
Stock 16Can Ship Immediately
$ 0.4
Specifications
Series: PH3
Part Status: Active
Type: Heat Spreader
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Adhesive
Shape: Rectangular
Length: 2.000" (50.80mm)
Width: 0.500" (12.70mm)
Diameter: --
Height Off Base (Height of Fin): 0.008" (0.21mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Copper
Material Finish: Polyester
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

PH3-50.8-12.7-0.21-1A Thermal - Heat Sinks Application Field and Working PrincipleThe PH3-50.8-12.7-0.21-1A Thermal - Heat Sinks have wide range of applications in various industries and fields. In electrical, engineering, and manufacturing industries, this special type of heat sink is used to dissipate heat and maintain efficient functioning of electronic components. In general, this thermal heat sink is used for dissipating heat generated from computer processors, power semiconductors, and other high power components.The PH3-50.8-12.7-0.21-1A Thermal - Heat Sinks are also commonly used in many domestic applications like air-conditioners and refrigerators. They directly reduce the rate of heat transfer from hot components or systems to coolants or surroundings. This helps in efficient operation of the components as well as proper functioning of the systems. They come in various shapes and sizes and are usually made of aluminum or other thermally conductive materials such as copper. The size of the sink depends on the size and heat dissipation requirements of the component it is used with.The working principle of the PH3-50.8-12.7-0.21-1A Thermal - Heat Sinks is based on thermoelectric cooling. It works on the principle of heat transfer and thermoelectricity whereby the heat is dissipated from the component to the surrounding environment. The thermal heat sink consists of a set of fins connected to a flat plate. The heat generated by the component is conducted through the flat plate and is then absorbed by the fins, which disperse the heat in the surrounding air or environment.The PH3-50.8-12.7-0.21-1A Thermal - Heat Sinks are designed to optimize the heat transfer quickly and at the same time minimize noise. The fins are normally connected with each other with a specially designed thermal spreading plate and the fins have increased surface area for better heat dissipation. The fins also have a specially designed air gap to allow the heat to dissipate quickly without resistance. This ensures that the component works effectively and noiselessly.The PH3-50.8-12.7-0.21-1A Thermal - Heat Sinks are often used with active cooling systems such as fan and heatsink combination for best results. The active cooling systems work by drawing air through the heat sink by creating an air flow over the fins. This helps in quicker heat dissipation and ensures that the component is cooled to the desired temperature. When used in combination with a fan, the noise generated by the component is also minimized.In conclusion, the PH3-50.8-12.7-0.21-1A Thermal - Heat Sinks are an effective and efficient thermal heat sink that help dissipate heat generated by electronic components. This allows the components to function properly at desired temperatures without excessive noise and can also increase the efficiency of many systems used in the industry.

The specific data is subject to PDF, and the above content is for reference

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