PH3-76.2-12.7-0.21-1A

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are thermal management solutions that are used to transfer heat away from electrical and electronic components that typically generate large amounts of heat, such as processors, amplifiers, and motors. Heat sinks are composed of a base material, such as a metal or thermoplastic, and a large number of fins. Heat sinks come in a variety of shapes and sizes, and can be customized to fit a particular application. PH3-76.2-12.7-0.21-1A is part of a series of thermal management heat sink solutions. This article will discuss the application fields and working principle of PH3-76.2-12.7-0.21-1A.

The PH3-76.2-12.7-0.21-1A is typically used in applications with high heat loads, such as power supplies, in which reliable and efficient heat transfer is required. This heat sink features a rugged aluminum construction and a high strength, durable thermally conductive adhesive to provide a superior heat transfer solution. It has a profile height of 76.2 mm (3.0") and a base size of 12.7 mm (0.50") for compatibility with a wide range of components. The base thickness is 0.21 mm (0.008") for efficient heat transfer and it has a unique fin pattern that maximizes heat transfer.

To understand the working principle of the PH3-76.2-12.7-0.21-1A, it is important to understand how heat sinks work. Heat sinks are designed to transfer heat away from a hot component by dissipating it into the surrounding air. Heat is transferred from the component to the heat sink by conduction, and then from the heat sink to the ambient air by convection. Heat sinks also utilize radiation, which is the transfer of energy from one body to another without the need for direct contact. In the case of the PH3-76.2-12.7-0.21-1A, the fins increase the surface area, which increases the rate of heat transfer.

The PH3-76.2-12.7-0.21-1A can be used in a wide range of applications, including commercial, industrial, and military. These heat sinks are ideal for applications that require efficient heat transfer and reliable performance, such as cooling of Power Supply Unit (PSU). It can also be used to cool high-performance processors, such as those used in gaming systems, servers, and workstations.

The PH3-76.2-12.7-0.21-1A is also well-suited for applications in the automotive, aerospace, and medical industries. These heat sinks can be used to cool high-temperature electric motors, and to transfer heat away from sensitive components in medical devices. In aerospace applications, these heat sinks can be used to keep sensitive electronics running at a stable temperature in high-altitude or vibration environments.

The PH3-76.2-12.7-0.21-1A is one of the most efficient and reliable thermal management solutions available. It features a rugged aluminum construction, a high strength, durable thermally conductive adhesive, and a unique fin pattern that maximizes heat transfer. This heat sink is ideal for applications with high heat loads, and can be used in a wide range of industries.

The specific data is subject to PDF, and the above content is for reference