| Allicdata Part #: | 1168-2070-ND |
| Manufacturer Part#: |
PH3-76.2-19.1-0.21-1A |
| Price: | $ 0.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | t-Global Technology |
| Short Description: | PH3 76.2X19.1X0.21MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper... |
| DataSheet: |  PH3-76.2-19.1-0.21-1A Datasheet/PDF |
| Quantity: | 100 |
| 1 +: | $ 0.74970 |
| 10 +: | $ 0.70938 |
| 25 +: | $ 0.69098 |
| 50 +: | $ 0.67221 |
| 100 +: | $ 0.63491 |
| 250 +: | $ 0.59754 |
| 500 +: | $ 0.56020 |
| 1000 +: | $ 0.52285 |
| 5000 +: | $ 0.50418 |
| Series: | PH3 |
| Part Status: | Active |
| Type: | Heat Spreader |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Adhesive |
| Shape: | Rectangular |
| Length: | 3.000" (76.20mm) |
| Width: | 0.750" (19.05mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.008" (0.21mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Copper |
| Material Finish: | Polyester |
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Thermal - Heat Sinks
The PH3-76.2-19.1-0.21-1A is a type of heat sink designed for thermal management. It was created to help cool electronics and components, particularly those that are connected to sensitive circuitry.
The PH3-76.2-19.1-0.21-1A is made up of a finned heat sink with an aluminum base. By having the fins on the side, the heat can spread out evenly without having any concentration points on the base. This helps the heat to spread out more effectively and efficiently. The aluminum also helps to dissipate heat, as it is an excellent conductor.
The PH3-76.2-19.1-0.21-1A can be used in many different applications. The most common is in computers and other electronics that require thermal management. The fins can be used to help keep components from overheating and damaging the system. The aluminum also helps to quickly dissipate the heat that is generated by the electronics.
In addition to dissipating heat more efficiently than traditional heatsinks, the PH3-76.2-19.1-0.21-1A can also be used in mass production processes such as injection molding and diecasting. By using the fins to spread the heat, the parts being created can be cooled more quickly and effectively. This allows the parts to be created more quickly, helping to speed up the process and save time.
Another use of the PH3-76.2-19.1-0.21-1A is in circuit boards. By having the fins on the heat sink, the heat can be dissipated more effectively. This helps to reduce the possibility of thermal runaway, which can cause the board to fail or malfunction. This also helps to save energy, as less power is needed to cool the circuit board.
The PH3-76.2-19.1-0.21-1A can also help to prevent other components from overheating. By having the fins on the heat sink, the heat will dissipate more quickly across the surface, thus helping to avoid overheating. This is important in situations where other components in the system may be sensitive to heat, such as video cards or sound cards.
The PH3-76.2-19.1-0.21-1A is an effective and efficient way to keep electronic components cool. With its fins on the side, it helps to dissipate heat more effectively across the surface, and by having the aluminum base, it helps to improve heat dissipation even further. This makes it ideal for any situation where thermal management is an issue, such as computers, mass production processes, and circuit boards.
The specific data is subject to PDF, and the above content is for reference